Method for manufacturing a ceramic capacitor having varistor characteristics

ABSTRACT

The elements of the present invention are used for circuits in electronic devices and the objective is to absorb the noises and surges occurring in the circuits. In order to achieve the above objective, the present invention discloses a method for manufacturing a ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant mainly forming a liquid phase at a high temperature, a semiconducting accelerant that can form a solid solution with perovskite type oxides, a control agent to control the grain growth for porous sintering and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of SrTiO 3  as a main component, mixing and forming followed by sintering to a porous body; being made semiconductive by reduction and diffusing oxygen and oxidizing the forming agent to form a grain boundary depletion layer in the oxidizing atmosphere so as to form a barrier in the grain boundary and electrodes, thereby having excellent ability to absorb the above noises and surges.

TECHNICAL FIELD

This invention relates to a method for manufacturing a ceramic capacitor having varistor characteristics used in electronic devices or the like.

BACKGROUND ART

It is known that a capacitor element body with a very large apparent dielectric constant compared with a conventional ceramic dielectric can be obtained by insulating the crystal grain boundaries in a ceramic oxide semiconductor such as SrTiO₃. It is also known that in a varistor where the current rises suddenly at threshold voltage can be obtained by forming electrodes on the element body. These elements are widely used for the circuits in electronic devices or the like to absorb noises. That is, low noise level of the element is advantageous in the application of it as a circuit element mounted with a capacitor while it can be used as a varistor to absorb large surge current.

For example, materials with large apparent dielectric constant of 2,000 to 100,000 are used as materials for a ceramic capacitor of grain boundary barrier type obtained by the following steps; diffusing cupric oxide (CuO) and bismuth trioxide (Bi₂ O₃) from the surface of the sintered body into a grain boundary of polycristalline ceramic semiconductor composed of SrTiO₃ as a main component formed by adding Nb₂ O₅ and TiO₂ -Al₂ O₃ -SiO₂ compound and sintered in a reducing atmosphere, and forming a resistance layer in a grain boundary by forming a depletion layer in the crystal grain boundaries. The functions of CuO and Bi₂ O₃ as are often used as diffusion materials in a conventional manufacturing method are as follows: CuO containing sufficient oxygen forms a electron trap center in an crystal grain boundaries of the sintered body and traps electrons existing near the crystal grain boundaries of n-type semiconductor SrTiO₃, thereby forming a depletion layer near the grain boundary where electrons do not exist. A capacitor is composed of the materials for a ceramic capacitor of grain boundary barrier type, charging electric loads on both sides of the insulated depletion layer thus formed.

On the other hand, it is known that varistor characteristics which raise the current suddenly at the threshold voltage or more appear when Na oxide or the like is added to a diffused material, Bi₂ O₃. This threshold voltage is also called the varistor voltage and is defined as the voltage that the current of 1 mA flows through varistor elements when a voltage is applied.

In the materials for the aforementioned ceramic capacitor of grain boundary barrier type, the apparent dielectric constant of the sintered body is approximately the value that the dielectric constant of SrTiO₃ (approximately 200) is multiplied by the ratio of the grain diameter of SrTiO₃ in the sintered body to the thickness of said grain boundary depletion layer (grain diameter / the thickness of grain boundary depletion layer). A typical thickness of the grain boundary depletion layer of the SrTiO₃ sintered body is about 0.2 μm. The standards of apparent dielectric constant are 2,000, 20,000, 200,000 corresponding to the grain diameters of the SrTiO₃ sintered body of 2 μm, 20 μm, and 200 μm, respectively.

Bi₂ O₃ which is added to form a barrier in a grain boundary is known as a good conductor of oxygen when Bi₂ O₃ is a β-Bi₂ O₃ and δ-Bi₂ O₃ phase. When the surface of the sintered body is coated with Bi₂ O₃ and heat-treated, Bi₂ O₃ is first diffused along the grain boundary of the sintered body and then oxygen is transported by diffusion from outside to the inner portion of the sintered body along Bi₂ O₃ existing in the grain boundary. Bi₂ O₃ works to supply necessary oxygen to form the grain boundary depletion layer. This grain boundary barrier type of ceramic varistor having a high electrostatic capacitance displays excellent electrostatic capacitance and temperature characteristics and provides wide application fields in the industrial fields.

The aforementioned ceramic varistor having a high electrostatic capacitance of grain boundary barrier type is manufactured by the following steps; generally sintering is carried out at a high temperature so as to make the crystal grains in the sintered body as large as possible, by coating the sintered body with pasted cupric oxide and bismuth trioxide, etc. containing sodium oxide, followed by the heat treatment so as to diffuse such oxides as Bi₂ O₃, CuO, NaO into the inner portion of the sintered body and oxidize it.

When a ceramic capacitor with varistor characteristics having a high capacitance is manufactured by the method mentioned above it is required to uniformly diffuse Bi₂ O₃, Na₂ O and CuO or the like from the surface of the sintered body into the inner portion thereof during the process. Nonuniform coating of diffused materials or the like is prone to cause variation in characteristics and, further, it is difficult to diffuse enough Bi₂ O₃, Na₂ O and CuO or the like into the inner portion of the sintered body when it is thick, which causes problems such as limitation of the element size.

In addition, in a grain boundary barrier type ceramic varistor with large electrostatic capacitance, it is electrically required to have uniform characteristics and stability of characteristics against high voltage pulses, therefore a uniform material composition is required.

The present invention has an objective to provide a ceramic capacitor having varistor characteristics which solves these problems.

DISCLOSURE OF THE INVENTION

A ceramic capacitor having varistor characteristics of the present invention, which solved the aforementioned problems, is manufactured by the steps comprising; adding a sintering accelerant, a semiconducting accelerant, a control agent, and a forming agent to perovskite type oxides powder made of SrTiO₃ as a main component, mixing and forming followed by sintering to a porous body; being made semiconductive by reduction and diffusing oxygen and oxidizing the forming agent to form a grain boundary depletion layer in the oxidizing atmosphere so as to form a barrier in the grain boundary and electrodes, wherein said sintering accelerant mainly forms a liquid phase at a high temperature, said semiconducting accelerant can form a solid solution with perovskite type oxides, said control agent controls the grain growth for porous sintering, and said forming agent forms a grain boundary depletion layer which also functions as a control agent to control the grain growth.

As mentioned above, in a conventional method, a capacitor was manufactured by coating the outer surface of the sintered body which was made semiconductive with Bi₂ O₃ or the like, and heat-treating the sintered body in the oxidizing atmosphere so as to diffuse Bi₂ O₃ and oxygen in the whole body, oxidize the crystal grain boundaries to form the depletion layer in the grain boundary. However, the feature of the present invention is to manufacture a capacitor by a special sintering method to form fine porosities along a triple point of crystallite in the sintered body and diffuse oxygen along the porosities in the heat treatment in the oxidizing atmosphere so as to oxidize the grain boundary and form the depletion layer.

One of the important points of the present invention is to form fine porosities along the triple point of crystallite, which is made possible by a sensitive interaction between the sintering accelerant and the a control agent to control the grain growth.

As mentioned above, according to the manufacturing method of the present invention, a uniform porous body can be obtained without complicated processes of coating and diffusing Bi₂ O₃ or the like, and, moreover, the size of the porous body is not subject to any particular restriction.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a schematic diagram showing a laminated ceramic capacitor having varistor characteristics according to an example of the present invention and

FIG. 2 is a schematic diagram of a ceramic capacitor having varistor characteristics according to another example of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

The outline of the present invention will now be described.

A sintering accelerant mainly forming a liquid phase at a high temperature, a semiconducting accelerant which can form a solid solution with perovskite type oxides, a control agent to control the grain growth for porous sintering, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth are added to and mixed with perovskite type oxides powder made of the materials of SrTiO₃ as a main component followed by the pressure molding. When they are calcinated to reduce in the air, or sintered in the reducing atmosphere at a high temperature, the sintering accelerant mainly forming a liquid phase at a high temperature accelerates the reaction between the forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, the semiconducting accelerant and perovskite type oxides powder made of SrTiO₃ as a main component so as to form the solid solution therebetween. The control agent to control the grain growth controls the growth of crystals and make the sintered body porous. The SrTiO₃ main component phase loses some oxygen by the reduction and becomes a n-type semiconducting substance, reacting with a semiconducting accelerant.

When the sintered body thus obtained is heat-treated in the oxidizing atmosphere, oxygen freely diffuses in the fine porosities formed at the tripple grain junctions in the grain boundary. Oxides including copper, manganese, cobalt or the like deposited in the crystal grain boundaries are further oxidized by oxygen reached thereto. Consequently, electron trap centers composed of cupric oxide, manganese oxide, cobalt oxide or the like as a main component are formed in the grain boundary. These electron trap centers trap electrons from the grains in the low resistant n-type SrTiO₃ semiconductors formed by the reduction, therefore forming the depletion layer of carriers along the grain boundary. The depletion layer thus obtained has an excellent insulating characteristic and a capacitor with varistor characteristics having high capacitance is obtained when the voltage is applied to the sintered body and electric loads are charged on both sides of the insulated depletion. This manufacturing method does not require the processes to coat and diffuse CuO, Bi₂ O₃ or the like after the sintered body is made semiconductive and a ceramic capacitor having varistor characteristic is readily provided.

FIG. 1 is a schematic diagram showing a laminated ceramic capacitor having varistor characteristics according to an example of the present invention comprising a ceramic capacitor having varistor characteristics 1, inner electrodes 2, an outer electrode 3. FIG. 2 is a schematic diagram of a ceramic capacitor having varistor characteristics according to another example of the present invention comprising a ceramic 4 with varistor characteristics having high capacitance, an electrode 5, and a lead line 6.

The specific examples of the present invention will be described hereinafter.

EXAMPLE 1

A sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ (ratio of 20:30:45 wt %) of 0.05 to 6.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Nb₂ O₅ of 0.02 to 3.0 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte ZrO₂ of 0.05 to 12.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to strontium titanat (SrTiO₃) obtained by pyrolyzing titanyl strontium oxalate (SrTio(C₂ O₄)₂ ·4H₂ O) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making the grain, and molding, sintering at 1300° C. in the air. It was re-ground in a wet state, made into paste using resin and organic solutions so as to form a sheet, printed platinum paste for inner electrodes were laminated thereon, sintered at 1400° C. in the air followed by the hydrogen reduction at 1300° C., and heat-treated at 950° C. in the air. Finally, electrodes were adjusted so as to connect inner electrodes with outer electrodes, thereby completing the manufacture of a laminated ceramic capacitor having grain boundary varistor characteristics of FIG. 1. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 1. The sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ (ratio of 20:30:45 wt %) was obtained by weighing commercial TiO₂ --Al₂ O₃ --SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, CuO or the like, calcinating at 1000° C., and grinding.

The size of the varistor after sintering was approximately 4 mm square and about 0.6 mm in thickness and composed of 8 layers of the dielectrics each of which was about 70 μm in thickness. The apparent dielectric constant ε was calculated from the value of the capacitance (measurement 1 kHz) of the laminated varistor. The grain diameter in the sintered body was obtained by examining a cross section after polishing under an optical microscope, to the surface of which Bi₂ O₃ series metallic soap was applied and heat-treated at 1000° C. to make the grain boundary clear.

                                      TABLE 1                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.5     3200                                                                              9.5   440     4.5                0.1       0.2  0.5         0.8     6.5     7300                                                                              1.7   450     12                 0.5       0.2  0.5         0.8     7.0     7500                                                                              0.9   400     12                 1.0       0.2  0.5         0.8     7.5     8300                                                                              0.9   3800    11                 3.0       0.2  0.5         0.8     6.5     7400                                                                              1.0   430     11                 5.0       0.2  0.5         0.8     7.5     8200                                                                              0.9   360     11                 6.0       0.2  0.5         0.8     7.5     8100                                                                              0.8   350     12                 1.0       0.02 0.5         0.8     6.0     7200                                                                              35.0  230     4.5                1.0       0.05 0.5         0.8     7.0     7600                                                                              1.6   430     11                 1.0       0.5  0.5         0.8     7.0     7500                                                                              0.7   390     12                 1.0       2.0  0.5         0.8     6.5     7200                                                                              1.8   450     11                 1.0       3.0  0.5         0.8     4.0     6200                                                                              15.0  380     4.0                1.0       0.2  0.1         0.8     5.0     6900                                                                              9.9   250     3.0                1.0       0.2  0.2         0.8     7.5     8100                                                                              1.3   380     12                 1.0       0.2  0.5         0.8     7.5     8400                                                                              0.6   350     11                 1.0       0.2  2.0         0.8     8.0     8800                                                                              0.8   350     11                 1.0       0.2  4.0         0.8     7.5     8300                                                                              1.9   370     12                 1.0       0.2  6.0         0.8     7.0     7500                                                                              14.1  210     4.0                1.0       0.2  0.5         0.05    7.0     4100                                                                              26.5  270     4.5                1.0       0.2  0.5         0.1     7.5     8300                                                                              1.8   380     12                 1.0       0.2  0.5         1.0     8.0     8600                                                                              0.9   340     12                 1.0       0.2  0.5         5.0     8.0     8700                                                                              1.1   370     11                 1.0       0.2  0.5         10.0    6.5     7300                                                                              1.6   430     11                 1.0       0.2  0.5         12.0    5.5     6400                                                                              7.7   270     4.0                __________________________________________________________________________

As is apparent from the results in Table 1, the present material obtained by adding to SrTiO₃ a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ of 0.2 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high electrostatic capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body was uniform and approximately 7 μm in thickness and the dielectric loss was 2.0% or less and the apparent dielectric constant was 7,000 or more. The rising voltage V₁ mA of the materials as a varistor was 300 to 500 V/mm and the resistance nonlinear exponent α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as withstanding-surge-current as a varistor, the ratio of limited voltage representing the resistance nonlinear exponent in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 2)

A sintering accelerant of 1.0 wt % selected from TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %), TiO₂ --MnO--SiO₂ series (for example, ratio of 10:50:40 wt %), TiO₂ --Al₂ O₃ --SiO₂ series (for example, ratio of 20:35:45 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.04 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ of 0.4 to 3.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molded into like a disk shape, sintered at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and silver electrodes were formed on both sides of the disk, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 2.

The sintering accelerant TiO₂ -MgO-SiO₂ series (for example, ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅ and CuO, calcinating at 900° C., and grinding.

                                      TABLE 2                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Cu.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     7.5     8400                                                                              1.6   380     13                 1.0       0.4  3.0         2.0     6.5     7300                                                                              1.2   450     12                 1.0       0.4  1.0         0.2     7.5     8100                                                                              1.5   400     11                 1.0       0.4  1.0         8.0     7.5     8300                                                                              0.9   370     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     7.0     7500                                                                              1.4   380     13                 1.0       0.4  3.0         2.0     6.5     7200                                                                              1.1   470     13                 1.0       0.4  1.0         0.2     7.0     7600                                                                              1.5   420     11                 1.0       0.4  1.0         8.0     6.5     7400                                                                              0.9   440     12                 TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     8.0     8600                                                                              1.7   360     11                 1.0       0.4  3.0         2.0     8.5     9200                                                                              1.3   320     13                 1.0       0.4  1.0         0.2     8.5     9300                                                                              1.2   340     11                 1.0       0.4  1.0         8.0     8.0     8700                                                                              0.9   350     11                 __________________________________________________________________________

As is apparent from the results in Table 2, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 3.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 1.

EXAMPLE 3

A sintering accelerant of 3.0 wt % of TiO₂ --MgO--SiO₂ series (for example, ratio of 0:30:40 wt %) mainly forming a liquid phase at a high temperature, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a good oxygen conductive solid electrolyte ZrO₂ of 1.5 wt % which functions as a control agent to control the grain growth, and a forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintered at 380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 1050° C. in the air and electrodes were formed, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 3.

The sintering accelerant TiO₂ --MgO--SiO₂ series (ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Nb₂ O₅ and CuO, calcinating at 900° C., and grinding.

                                      TABLE 3                                      __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8300                                                                              1.2   380     12                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.0     7300                                                                              1.5   410     13                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7200                                                                              1.1   430     12                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.0     7400                                                                              1.2   420     13                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.5     8400                                                                              1.4   370     13                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.5     8300                                                                              1.0   390     13                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.5     8200                                                                              1.4   380     13                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.5     8400                                                                              1.1   390     12                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.3 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.0     7500                                                                              1.7   400     11                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7100                                                                              1.8   450     12                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7300                                                                              1.6   420     11                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.0     7300                                                                              1.7   410     11                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 3, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 1.

EXAMPLE 4

A capacitor was manufactured according to the method in Example 1 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Ta_(2/3))O₃ (0.1 to 0.6 wt %) was used instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 0.6 wt %) to form a grain boundary depletion and electric characteristics thereof were measured in the same method as Example 1 and the results are shown in Table 4.

The forming agent Sr(Cu_(1/3) Ta_(2/3))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Ta₂ O₅, and CuO, sintering at 1000° C. and grinding.

                                      TABLE 4                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/3 Ta.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.5     3100                                                                              7.4   370     7.5                0.1       0.2  0.5         0.8     6.0     7100                                                                              1.7   490     12                 0.5       0.2  0.5         0.8     6.5     7300                                                                              1.8   460     11                 1.0       0.2  0.5         0.8     6.5     7400                                                                              1.1   440     12                 3.0       0.2  0.5         0.8     6.5     7300                                                                              0.8   450     11                 5.0       0.2  0.5         0.8     7.0     7500                                                                              1.6   420     12                 6.0       0.2  0.5         0.8     7.5     8200                                                                              1.4   380     12                 1.0       0.02 0.5         0.8     7.5     5500                                                                              28.0  250     6.5                1.0       0.05 0.5         0.8     6.5     7300                                                                              1.8   470     11                 1.0       0.5  0.5         0.8     7.5     8100                                                                              0.9   370     12                 1.0       2.0  0.5         0.8     7.0     7600                                                                              1.7   430     11                 1.0       3.0  0.5         0.8     4.5     5800                                                                              25.9  320     7.0                1.0       0.2  0.1         0.8     5.0     6000                                                                              8.4   310     6.0                1.0       0.2  0.2         0.8     6.5     7200                                                                              1.5   470     12                 1.0       0.2  1.0         0.8     7.5     8300                                                                              0.7   380     12                 1.0       0.2  2.0         0.8     7.0     7400                                                                              0.6   390     12                 1.0       0.2  5.0         0.8     6.5     7400                                                                              1.6   430     11                 1.0       0.2  6.0         0.8     6.0     6100                                                                              18.1  290     6.0                1.0       0.2  0.5         0.05    4.5     3500                                                                              31.4  200     4.5                1.0       0.2  0.5         0.1     6.5     7200                                                                              1.5   450     11                 1.0       0.2  0.5         1.0     7.0     7700                                                                              0.7   420     11                 1.0       0.2  0.5         3.0     7.0     7500                                                                              1.0   390     12                 1.0       0.2  0.5         10.0    6.5     7800                                                                              1.8   440     11.0               1.0       0.2  0.5         12.0    5.5     6200                                                                              14.5  270     7.5                __________________________________________________________________________

As is apparent from the results in Table 4, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Cu_(1/3) Ta_(2/3))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high electrostatic capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 6.0 to 7.0 μm and the dielectric loss was 20% or less and the apparent dielectric constant was 7000 or more.

The riser voltage V₁ mA of the materials as a varistor was 350 to 500 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 5

A capacitor was manufactured according to the method in Example 2 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Ta_(2/3))O₃ (0.4 to 4.0 wt %) was used instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion and electric characteristics thereof were measured by the same method as Example 2 and the results are shown in Table 5. The forming agent Sr(Cu_(1/3) Ta_(2/3))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Ta₂ O₅, and CuO, sintering at 900° C. and grinding.

                                      TABLE 5                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Cu.sub.1/3 Ta.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     6.0     7100                                                                              1.8   480     13                 1.0       0.4  4.0         2.0     6.0     7200                                                                              1.1   490     12                 1.0       0.4  1.0         0.2     6.0     7200                                                                              1.7   490     12                 1.0       0.4  1.0         8.0     6.5     7300                                                                              1.0   470     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     6.0     7100                                                                              1.7   490     13                 1.0       0.4  4.0         2.0     6.5     7100                                                                              1.2   450     12                 1.0       0.4  1.0         0.2     6.5     7300                                                                              1.9   440     13                 1.0       0.4  1.0         8.0     7.0     7500                                                                              1.2   420     12                 TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     6.5     7200                                                                              1.8   460     13                 1.0       0.4  4.0         2.0     7.0     7400                                                                              1.2   400     12                 1.0       0.4  1.0         0.2     7.0     7600                                                                              1.8   410     11                 1.0       0.4  1.0         8.0     6.5     7400                                                                              0.9   450     12                 __________________________________________________________________________

As is apparent from the results in Table 5, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 4.

EXAMPLE 6

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Ta_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Ta_(2/3))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Ta₂ O₅, and CuO, sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured in the same method as Example 3 and the results are shown in Table 6.

                                      TABLE 6                                      __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8300                                                                              0.8   380     11                                (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7300                                                                              0.9   470     12                           0.05 (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.0     7100                                                                              1.0   490     12                           0.05 (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7300                                                                              1.1   460     11                           0.05 (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.0     7500                                                                              1.8   420     13                                (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     6.5     7200                                                                              1.0   440     12                           0.50 (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     6.5     7400                                                                              1.3   460     13                           0.50 (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     6.5     7200                                                                              1.1   470     13                            0.50                                                                               (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.0     7600                                                                              1.6   410     11                                (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.5     7300                                                                              1.7   460     11                           2.0  (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.0     7100                                                                              1.8   480     12                           2.0  (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.0     7200                                                                              1.8   490     11                           2.0  (Cu.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 6, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 4.

EXAMPLE 7

The forming agent Sr(Co_(1/3) Nb_(2/3))O₃ (0.1 to 8.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was same as Example 1 and electric characteristics thereof were measured in the same method as Example 1 and the results are shown in Table 7. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, and CuO, sintering at 1000° C. and grinding.

                                      TABLE 7                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Co.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.5     3500                                                                              23.0  230     4.5                0.1       0.2  0.5         0.8     8.0     8700                                                                              2.3   320     11                 0.5       0.2  0.5         0.8     8.5     9200                                                                              2.4   310     12                 1.0       0.2  0.5         0.8     8.5     9100                                                                              2.1   320     12                 3.0       0.2  0.5         0.8     8.0     8600                                                                              2.3   340     12                 5.0       0.2  0.5         0.8     8.0     8700                                                                              2.1   340     11                 6.0       0.2  0.5         0.8     8.5     9200                                                                              2.8   310     12                 1.0       0.02 0.5         0.8     5.0     6100                                                                              31.0  170     3.0                1.0       0.05 0.5         0.8     7.5     8300                                                                              2.2   360     12                 1.0       0.5  0.5         0.8     8.0     8700                                                                              2.6   350     11                 1.0       2.0  0.5         0.8     8.5     9300                                                                              2.4   330     11                 1.0       3.0  0.5         0.8     6.5     6100                                                                              22.5  190     3.5                1.0       0.2  0.1         0.8     7.0     6300                                                                              18.5  180     4.0                1.0       0.2  0.2         0.8     7.5     8400                                                                              2.3   370     11                 1.0       0.2  0.5         0.8     8.0     8800                                                                              2.5   330     12                 1.0       0.2  2.0         0.8     8.5     9200                                                                              2.4   320     12                 1.0       0.2  6.0         0.8     8.0     8600                                                                              2.2   340     12                 1.0       0.2  8.0         0.8     6.0     6200                                                                              12.5  220     4.5                1.0       0.2  0.5         0.05    6.5     6700                                                                              17.5  210     5.0                1.0       0.2  0.5         0.1     7.5     8200                                                                              2.5   350     12                 1.0       0.2  0.5         1.0     8.5     9400                                                                              2.4   310     12                 1.0       0.2  0.5         5.0     8.5     9600                                                                              2.6   320     12                 1.0       0.2  0.5         10.0    8.0     8700                                                                              2.3   340     11                 1.0       0.2  0.5         12.0    6.0     6600                                                                              18.0  230     6.5                __________________________________________________________________________

As is apparent from the results in Table 7, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Co_(1/3) Nb_(2/3))O₃ of 0.2 to 6.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high electrostatic capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 8 μm and the dielectric loss was 3.0% or less and the apparent dielectric constant was 800,000 or more. The riser voltage V₁ mA of the materials as a varistor was 300 to 400 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the non-linearity resistive characteristics in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 8

The forming agent Sr(Co_(1/3) Nb_(2/3))O₃ (0.4 to 4.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 8.

The forming agent Sr(Co_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, and CoO, sintering at 900° C. and grinding.

                                      TABLE 8                                      __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     8.5     9000                                                                              2.5   320     11                 1.0       0.4  4.0         2.0     8.0     8600                                                                              2.3   340     11                 1.0       0.4  1.0         0.2     8.5     9400                                                                              2.4   330     12                 1.0       0.4  1.0         8.0     8.0     8800                                                                              2.2   350     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     8.5     9300                                                                              2.6   320     11                 1.0       0.4  4.0         2.0     7.5     8400                                                                              2.5   360     12                 1.0       0.4  1.0         0.2     8.5     9300                                                                              2.6   310     11                 1.0       0.4  1.0         8.0     8.0     8700                                                                              2.5   340     11                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     8.0     8600                                                                              2.4   330     12                 1.0       0.4  4.0         2.0     7.5     8300                                                                              2.4   370     11                 1.0       0.4  1.0         0.2     8.5     9400                                                                              2.3   320     11                 1.0       0.4  1.0         8.0     8.0     8800                                                                              2.6   350     12                 __________________________________________________________________________

As is apparent from the results in Table 8, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte ZrO of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high electrostatic capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 7.

EXAMPLE 9

The forming agent Sr₀.6 Ba₀.2 Ca₀.2 (Co_(1/3) Nb_(2/3))O₃ or Sr₀.8 Ba₀.1 Ca₀.1 (Co_(1/3) Nb_(2/3))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Nb₂ O₅, and CoO, sintering at 900° C. and grinding. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3. The results are shown in Table 9.

                                      TABLE 9                                      __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8600                                                                              2.3   330     12                                (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8800                                                                              2.1   340     11                           0.05 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8400                                                                              2.5   360     12                           0.05 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.5     9000                                                                              2.8   310     11                           0.05 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.0     8500                                                                              2.4   330     12                                (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.5     9200                                                                              2.4   310     12                           0.50 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.5     9100                                                                              2.2   320     12                           0.50 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.0     8800                                                                              2.3   350     11                           0.50 (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8300                                                                              2.5   350     12                                (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8700                                                                              2.5   320     12                           2.0  (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8200                                                                              2.7   340     11                           2.0  (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8800                                                                              2.6   330     11                           2.0  (Co.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 9, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high electrostatic capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 7.

EXAMPLE 10

The forming agent Sr(Co_(1/3) Ta_(2/3))O₃ (₀.1 to 8.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 1 and electric characteristics thereof were measured by the same method as Example 1. The results are shown in Table 10.

The forming agent Sr(CO_(1/3) Ta_(2/3))O to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Ta₂ O₅, and CoO, sintering at 1000° C. and grinding.

                                      TABLE 10                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Co.sub.1/3 Ta.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     3.0     3400                                                                              15.0  160     4.5                0.1       0.2  0.5         0.8     7.0     7600                                                                              1.2   380     13                 0.5       0.2  0.5         0.8     7.5     8300                                                                              1.3   340     12                 1.0       0.2  0.5         0.8     8.0     8700                                                                              1.1   310     12                 3.0       0.2  0.5         0.8     8.0     8600                                                                              1.4   320     12                 5.0       0.2  0.5         0.8     8.5     9100                                                                              1.8   310     13                 6.0       0.2  0.5         0.8     8.5     9300                                                                              1.6   320     13                 1.0       0.02 0.5         0.8     4.0     4800                                                                              45.0  150     4.0                1.0       0.05 0.5         0.8     7.0     7300                                                                              1.5   360     13                 1.0       0.5  0.5         0.8     7.5     8400                                                                              1.6   340     12                 1.0       2.0  0.5         0.8     8.0     8800                                                                              1.5   310     12                 1.0       3.0  0.5         0.8     3.5     4000                                                                              18.5  240     5.5                1.0       0.2  0.1         0.8     9.0     6200                                                                              32.0  250     5.0                1.0       0.2  0.2         0.8     7.5     8100                                                                              1.4   360     13                 1.0       0.2  0.5         0.8     8.0     8700                                                                              1.2   330     12                 1.0       0.2  2.0         0.8     8.0     8900                                                                              1.8   320     13                 1.0       0.2  7.0         0.8     8.5     9200                                                                              1.2   310     13                 1.0       0.2  8.0         0.8     4.5     5200                                                                              12.5  180     5.5                1.0       0.2  0.5         0.05    7.5     6500                                                                              18.0  220     7.0                1.0       0.2  0.5         0.1     7.5     8300                                                                              1.8   350     13                 1.0       0.2  0.5         1.0     8.0     8300                                                                              1.4   330     12                 1.0       0.2  0.5         5.0     7.5     8200                                                                              1.0   340     12                 1.0       0.2  0.5         10.0    7.0     7500                                                                              1.5   360     13                 1.0       0.2  0.5         12.0    6.0     6100                                                                              22.0  210     6.0                __________________________________________________________________________

As is apparent from the results in Table 10, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt%, and a forming agent Sr(Co_(1/3) Ta_(2/3))O₃ of 0.2 to 7.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high electrostatic capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 7.0 to 8.0 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 7,000 or more. The riser voltage V.sub. 1 mA of the materials as a varistor was 300 to 400 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 11

The forming agent Sr(Co_(1/3) Ta_(2/3))O₃ (0.4 to 6.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 11.

The forming agent Sr(Co_(1/3) Ta_(2/3))O₃ to form a grain boundary depletion was obtained by mixing commercial SrCO₃, Ta₂ O₅ and CoO sintering at 900° C. and grinding.

                                      TABLE 11                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/3 Ta.sub.2/3)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     8.5     9500                                                                              1.4   320     13                 1.0       0.4  6.0         2.0     7.5     8300                                                                              1.5   360     12                 1.0       0.4  1.0         0.2 8.0 8500    1.4                                                                               340   12                         1.0       0.4  1.0         8.0     8.0     8700                                                                              1.7   330     13                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     8.5     9100                                                                              1.4   320     12                 1.0       0.4  6.0         2.0     8.0     8600                                                                              1.6   360     12                 1.0       0.4  1.0         0.2     8.0     8800                                                                              1.5   330     13                 1.0       0.4  1.0         8.0     7.5     8400                                                                              1.3   350     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     8.5     9400                                                                              1.8   310     12                 1.0       0.4  6.0         2.0     8.0     8600                                                                              1.6   340     12                 1.0       0.4  1.0         0.2     8.5     9300                                                                              1.3   310     13                 1.0       0.4  1.0         8.0     7.5     8100                                                                              1.7   350     12                 __________________________________________________________________________

As is apparent from the results in Table 11, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 6.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high electrostatic capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 10.

EXAMPLE 12

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Co_(1/3) Ta_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Co_(1/3) Ta_(2/3))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.60 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Ta₂ O₅, and CoO sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3 and the results are shown in Table 12.

                                      TABLE 12                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.5     9300                                                                              1.3   310     12                                (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8800                                                                              1.2   330     13                           0.05 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8500                                                                              1.3   350     12                           0.05 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8700                                                                              1.3   320     13                           0.05 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.0     8900                                                                              1.6   320     13                                (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.0     8800                                                                              1.5   330     12                           0.50 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     8.5     9200                                                                              1.6   320     12                           0.50 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     7.5     8200                                                                              1.4   370     13                           0.50 (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.0     8700                                                                              1.4   330     12                                (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     8.5     9100                                                                              1.5   310     11                           2.0  (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8300                                                                              1.6   360     11                           2.0  (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     7.5     8400                                                                              1.6   370     13                           2.0  (Co.sub.1/3 Ta.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 12, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high electrostatic capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 10.

EXAMPLE 13

The forming agent Sr(Cu_(1/3) W_(2/3))O₃ (0.1 to 6.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 1 and electric characteristics thereof were measured by the same method as Example 1. The results are shown in Table 13. The forming agent Sr(Cu_(1/2) W_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃, and CoO, sintering at 1000° C. and grinding.

                                      TABLE 13                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/2 W.sub.1/2)O.sub.3                                                            growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.5     3300                                                                              19.5  190     4.0                0.1       0.2  0.5         0.8     5.0     6200                                                                              1.6   610     12                 0.5       0.2  0.5         0.8     5.0     5800                                                                              1.6   580     12                 1.0       0.2  0.5         0.8     5.5     6300                                                                              1.3   540     11                 3.0       0.2  0.5         0.8     6.0     6500                                                                              1.7   480     12                 5.0       0.2  0.5         0.8     6.0     6800                                                                              1.4   500     11                 6.0       0.2  0.5         0.8     6.0     6700                                                                              1.8   480     12                 1.0       0.02 0.5         0.8     3.5     4200                                                                              26.5  180     4.5                1.0       0.05 0.5         0.8     5.0     6100                                                                              1.7   630     12                 1.0       0.5  0.5         0.8     5.0     5800                                                                              1.8   590     11                 1.0       2.0  0.5         0.8     5.5     6200                                                                              1.9   570     12                 1.0       3.0  0.5         0.8     4.5     5100                                                                              24.0  220     5.5                1.0       0.2  0.1         0.8     5.0     5900                                                                              15.5  240     5.0                1.0       0.2  0.2         0.8     5.5     6300                                                                              1.8   550     11                 1.0       0.2  0.5         0.8     6.0     6600                                                                              1.6   530     12                 1.0       0.2  2.0         0.8     6.0     6700                                                                              1.6   490     12                 1.0       0.2  5.0         0.8     5.5     6400                                                                              1.8   540     11                 1.0       0.2  6.0         0.8     5.0     6000                                                                              10.5  180     5.0                1.0       0.2  0.5         0.05    5.5     6400                                                                              14.0  150     6.0                1.0       0.2  0.5         0.1     5.5     6200                                                                              1.9   580     12                 1.0       0.2  0.5         1.0     5.0     6100                                                                              1.9   600     11                 1.0       0.2  0.5         5.0     5.5     6400                                                                              1.6   550     12                 1.0       0.2  0.5         10.0    5.0     5800                                                                              1.8   620     12                 1.0       0.2  0.5         12.0    4.0     4700                                                                              12.0  190     4.0                __________________________________________________________________________

As is apparent from the results in Table 13, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Cu_(1/2) W_(1/2))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high electrostatic capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 5.0 to 6.0 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 5500 or more. The riser voltage V₁ mA of the materials as a varistor was 450 to 650 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the nonlinearity resistive charac-teristics in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 14

The forming agent Sr(Cu_(1/2) W_(1/2))O₃ (0.4 to 4.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 14.

The forming agent Sr(Cu_(1/2) W_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃ and CoO sintering at 900° C. and grinding.

                                      TABLE 14                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Cu.sub.1/2 W.sub.1/2)O.sub.3                                                            growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     6.0     6500                                                                              1.6   480     13                 1.0       0.4  4.0         2.0     5.5     6200                                                                              1.5   560     12                 1.0       0.4  1.0         0.2     6.0     6600                                                                              1.6   520     12                 1.0       0.4  1.0         8.0     5.5     6400                                                                              1.5   530     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     5.5     6400                                                                              1.4   550     12                 1.0       0.4  4.0         2.0     5.0     6000                                                                              1.4   620     13                 1.0       0.4  1.0         0.2     6.0     6700                                                                              1.3   530     12                 1.0       0.4  1.0         8.0     5.5     6200                                                                              1.6   580     11                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     5.5     6300                                                                              1.5   530     12                 1.0       0.4  4.0         2.0     5.0     5900                                                                              1.3   580     12                 1.0       0.4  1.0         0.2     6.0     6600                                                                              1.4   500     13                 1.0       0.4  1.0         8.0     5.5     6100                                                                              1.2   540     13                 __________________________________________________________________________

As is apparent from the results in Table 14, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 13.

EXAMPLE 15

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/2) W_(1/2)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/2) W_(1/2))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, WO₂, and CuO, sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3. The results are shown in Table 15.

                                      TABLE 15                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.5     6600                                                                              1.9   530     12                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     6300                                                                              1.8   580     11                           0.05 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.5     6500                                                                              1.5   580     12                           0.05 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     6100                                                                              1.8   630     11                           0.05 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.0     6200                                                                              1.7   610     13                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.5     6400                                                                              1.7   560     12                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.5     6300                                                                              1.9   540     13                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.0     6200                                                                              1.8   590     12                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.0     6700                                                                              1.8   520     11                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     6300                                                                              1.7   600     11                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.5     6300                                                                              1.6   570     11                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     6.0     6600                                                                              1.7   510     12                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               __________________________________________________________________________

As is apparent from the results in Table 15, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 13.

EXAMPLE 16

The forming agent Sr(Co_(1/2) W_(1/2))O₃ (0.1 to 7.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 1 and electric characteristics thereof were measured by the same method as Example 1. The results are shown in Table 16. The forming agent Sr(Co_(1/2) W_(1/2))O₃ to form a grain boundary depletion was obtained by mixing commercial SrCO₃, WO₃, and CoO, sintering at 1000° C. and grinding.

                                      TABLE 16                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Co.sub.1/2 W.sub.1/2)O.sub.3                                                            growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.0     2200                                                                              35.0  190     3.0                0.1       0.2  0.5         0.8     4.5     5500                                                                              1.9   650     12                 0.5       0.2  0.5         0.8     5.0     5700                                                                              1.5   680     12                 1.0       0.2  0.5         0.8     5.0     5700                                                                              1.5   620     14                 3.0       0.2  0.5         0.8     5.0     5600                                                                              1.7   600     12                 5.0       0.2  0.5         0.8     5.5     5900                                                                              1.6   560     13                 6.0       0.2  0.5         0.8     5.5     5800                                                                              1.6   540     12                 1.0       0.02 0.5         0.8     4.5     5300                                                                              28.0  150     4.0                1.0       0.05 0.5         0.8     4.5     5600                                                                              1.8   660     11                 1.0       0.5  0.5         0.8     5.0     5800                                                                              1.5   630     11                 1.0       2.0  0.5         0.8     5.5     5700                                                                              1.5   540     13                 1.0       3.0  0.5         0.8     4.5     5000                                                                              15.5  140     3.5                1.0       0.2  0.1         0.8     5.5     6300                                                                              21.5  130     4.5                1.0       0.2  0.2         0.8     4.5     5400                                                                              1.6   660     13                 1.0       0.2  0.5         0.8     5.0     5600                                                                              1.4   590     13                 1.0       0.2  2.0         0.8     5.5     5900                                                                              1.6   530     14                 1.0       0.2  5.0         0.8     5.0     5800                                                                              1.8   610     13                 1.0       0.2  7.0         0.8     4.5     5500                                                                              14.5  200     4.0                1.0       0.2  0.5         0.05    6.0     6900                                                                              35.0  190     3.5                1.0       0.2  0.5         0.1     5.0     5700                                                                              1.7   590     12                 1.0       0.2  0.5         1.0     5.5     6100                                                                              1.6   570     12                 1.0       0.2  0.5         5.0     5.5     6200                                                                              1.6   560     13                 1.0       0.2  0.5         10.0    4.5     5600                                                                              1.5   640     12                 1.0       0.2  0.5         12.0    4.0     4600                                                                              12.0  220     5.5                __________________________________________________________________________

As is apparent from the results in Table 16, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Co_(1/2) W_(1/2))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 4.5 to 5.5 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 5000 or more. The riser voltage V₁ mA of the materials as a varistor was 500 to 700 V/mm and the resistance non-linearity coeffecient o is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the nonlinearity resistive charac-teristics in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 17

The forming agent Sr(Co₁₇₈ W_(1/2))O₃ (0.4 to 4.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 17.

The forming agent Sr(Co_(1/3) W_(2/3))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃ and CoO sintering at 900° C. and grinding.

                                      TABLE 17                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/2 W.sub.1/2)O.sub.3                                                            growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     5.0     5800                                                                              1.5   590     11                 1.0       0.4  4.0         2.0     4.5     5400                                                                              1.3   640     12                 1.0       0.4  1.0         0.2     5.5     6100                                                                              1.4   530     13                 1.0       0.4  1.0         8.0     5.0     5600                                                                              1.2   610     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     5.5     6000                                                                              1.6   560     11                 1.0       0.4  4.0         2.0     5.0     5700                                                                              1.5   620     13                 1.0       0.4  1.0         0.2     5.5     6100                                                                              1.6   550     11                 1.0       0.4  1.0         8.0     5.0     5600                                                                              1.5   590     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     5.5     5900                                                                              1.4   580     13                 1.0       0.4  4.0         2.0     4.5     5500                                                                              1.4   650     12                 1.0       0.4  1.0         0.2     5.5     6000                                                                              1.3   560     12                 1.0       0.4  1.0         8.0     5.0     5700                                                                              1.6   620     11                 __________________________________________________________________________

As is apparent from the results in Table 17, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 16.

EXAMPLE 18

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Co_(1/2) W_(1/2)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Co_(1/2) W_(1/2))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca_(O).1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 Ba₀.2 Ca_(1/3) (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, WO₃, and CoO, sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3. The results are shown in Table 18.

                                      TABLE 18                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                         tan δ (%)                                                                      V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.5     5600                                                                               1.3  630     12                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.5     5600                                                                               1.2  650     13                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     5900                                                                               1.2  590     13                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     6200                                                                               1.4  610     12                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.5     5700                                                                               1.3  670     13                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.0     6100                                                                               1.4  600     13                           0.50 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.5     5800                                                                               1.3  660     11                           0.50 (co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     5.0     6000                                                                               1.3  620     13                           0.50 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.5     5700                                                                               1.3  670     12                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.5     5800                                                                               1.3  650     12                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     5.0     6000                                                                               1.4  620     11                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.5     5600                                                                               1.5  660     11                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               __________________________________________________________________________

As is apparent from the results in Table 18, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 16.

EXAMPLE 19

The forming agent Sr(Co_(1/2) Mo_(1/2))O₃ (0.1 to 6.0 wt %) was added instead of the forming agent Sr(Cu_(1/2) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 1 and electric characteristics thereof were measured by the same method as Example 1. The results are shown in Table 19.

The forming agent Sr(Co_(1/2) Mo_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, MoO₃, and CoO, sintering at 1000° C. and grinding.

                                      TABLE 19                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Co.sub.1/2 Mo.sub.1/2)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     4.0      4400                                                                              17.0 170     5.5                0.1       0.2  0.5         0.8     9.0     10500                                                                              4.8  320     12                 0.5       0.2  0.5         0.8     10.0    11200                                                                              4.5  310     14                 1.0       0.2  0.5         0.8     10.0    11300                                                                              4.4  300     12                 3.0       0.2  0.5         0.8     10.0    11500                                                                              4.6  280     13                 5.0       0.2  0.5         0.8     11.0    12200                                                                              4.3  270     12                 6.0       0.2  0.5         0.8     11.0    12300                                                                              4.5  260     12                 1.0       0.02 0.5         0.8     9.0     10300                                                                              23.0 140     6.0                1.0       0.05 0.5         0.8     9.5     10800                                                                              4.3  290     14                 1.0       0.5  0.5         0.8     10.0    11200                                                                              4.5  290     13                 1.0       2.0  0.5         0.8     11.0    12000                                                                              4.4  280     14                 1.0       3.0  0.5         0.8     9.0      9500                                                                              17.5 110     4.5                1.0       0.2  0.1         0.8     8.0      8300                                                                              17.5 150     6.5                1.0       0.2  0.2         0.8     9.5     10700                                                                              4.6  320     12                 1.0       0.2  0.5         0.8     10.5    11100                                                                              4.1  300     13                 1.0       0.2  2.0         0.8     11.0    12200                                                                              4.6  270     13                 1.0       0.2  5.0         0.8     10.0    11300                                                                              4.8  290     14                 1.0       0.2  6.0         0.8     9.0     10300                                                                              12.5 170     4.5                1.0       0.2  0.5         0.05    12.0    13500                                                                              21.0 160     5.0                1.0       0.2  0.5         0.1     10.0    11300                                                                              4.7  290     12                 1.0       0.2  0.5         1.0     11.0    12200                                                                              4.6  270     14                 1.0       0.2  0.5         5.0     11.0    12400                                                                              4.6  260     14                 1.0       0.2  0.5         10.0    9.0     10200                                                                              4.5  310     11                 1.0       0.2  0.5         12.0    9.0      9200                                                                              16.0 210     6.5                __________________________________________________________________________

As is apparent from the results in Table 19, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent Sr(Co_(1/2) Mo_(1/2))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering, has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 9.0 to 10 μm and the dielectric loss was 5.0% or less and the apparent dielectric constant was 10000 or more. The riser voltage V₁ mA of the materials as a varistor was 250 to 350 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 20

The forming agent Sr(Co_(1/2) Mo_(1/2))O₃ (0.4 to 4.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(1/2))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 20. The forming agent Sr(Co_(1/2) Mo_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, MoO₃ and CoO sintering at 900° C. and grinding.

                                      TABLE 20                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/2 Mo.sub.1/2)O.sub.3                                                           growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     10.0    11200                                                                              4.5  310     12                 1.0       0.4  4.0         2.0     9.5     10800                                                                              4.2  320     12                 1.0       0.4  1.0         0.2     11.0    12200                                                                              4.4  280     13                 1.0       0.4  1.0         8.0     10.0    11100                                                                              4.1  290     13                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     11.0    12000                                                                              4.3  260     12                 1.0       0.4  4.0         2.0     10.0    11400                                                                              4.5  300     14                 1.0       0.4  1.0         0.2     11.0    12100                                                                              4.5  270     12                 1.0       0.4  1.0         8.0     10.5    11700                                                                              4.5  290     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     10.5    11800                                                                              4.4  280     14                 1.0       0.4  4.0         2.0     10.5    11600                                                                              4.1  270     12                 1.0       0.4  1.0         0.2     11.0    12000                                                                              4.3  270     13                 1.0       0.4  1.0         8.0     10.0    11300                                                                              4.3  300     12                 __________________________________________________________________________

As is apparent from the results in Table 20, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a solid electrolyte ZrO₂ of 0.2 to 8.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 19.

EXAMPLE 21

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Co_(1/2) Wo_(1/2)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Co_(1/2) Wo_(1/2))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3) or Sr₀.2 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Mo₃, and CoO, sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3. The results are shown in Table 21.

                                      TABLE 21                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     9.0     10100                                                                              4.3  330     13                                (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     9.5     10800                                                                              4.2  320     12                           0.05 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.0    11300                                                                              3.9  300     12                           0.05 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.0    11100                                                                              4.0  290     13                           0.05 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.0    11400                                                                              4.0  300     12                                (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.5    12200                                                                              3.5  280     12                           0.50 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.0    11000                                                                              4.1  300     13                           0.50 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.5    11800                                                                              4.0  270     12                           0.50 (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     9.5     10700                                                                              4.3  310     12                                (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.0    11200                                                                              3.8  290     12                           2.0  (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     9.5     10600                                                                              4.0  290     13                           2.0  (Co.sub. 1/2 Mo.sub.1/2)O.sub.3 2.0                             3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     10.5    12000                                                                              4.3  280     12                           2.0  (Co.sub.1/2 Mo.sub.1/2)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 21,

the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 19.

EXAMPLE 22

The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.1 to 10.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion of Example 1. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 1 and electric characteristics thereof were measured by the same method as Example 1. The results are shown in Table 22.

The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, MoO₃, and MnCO₃, sintering at 1000° C. and grinding.

                                      TABLE 22                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    SrO.1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3                                                       growth ZrO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     6.5      5500                                                                              9.2  220     5.5                0.1       0.2  0.5         0.8     9.5     10200                                                                              2.4  320     12                 0.5       0.2  0.5         0.8     9.5     10300                                                                              2.6  310     11                 1.0       0.2  0.5         0.8     9.5     10100                                                                              2.3  310     13                 3.0       0.2  0.5         0.8     10.0    10700                                                                              2.3  320     12                 5.0       0.2  0.5         0.8     9.5     10500                                                                              2.4  310     12                 6.0       0.2  0.5         0.8     10.0    10900                                                                              2.8  340     12                 1.0       0.02 0.5         0.8     7.0      5400                                                                              11.0 190     4.5                1.0       0.05 0.5         0.8     9.0      9800                                                                              2.6  340     11                 1.0       0.5  0.5         0.8     9.5     10200                                                                              2.5  320     13                 1.0       2.0  0.5         0.8     9.5     10100                                                                              2.3  320     13                 1.0       3.0  0.5         0.8     6.0      5500                                                                              14.5 180     3.4                1.0       0.2  0.1         0.8     10.5     5400                                                                              10.5 170     5.0                1.0       0.2  0.2         0.8     10.5    11000                                                                              2.7  310     13                 1.0       0.2  1.0         0.8     10.0    10500                                                                              2.5  330     12                 1.0       0.2  2.0         0.8     9.5     10100                                                                              2.7  310     14                 1.0       0.2  8.0         0.8     9.0      9700                                                                              2.4  320     12                 1.0       0.2  10.0        0.8     7.5      7100                                                                              11.5 150     3.5                1.0       0.2  0.5         0.05    12.0     7700                                                                              17.5 130     4.5                1.0       0.2  0.5         0.1     10.0    11000                                                                              2.7  310     12                 1.0       0.2  0.5         1.0     9.5     10400                                                                              2.2  330     12                 1.0       0.2  0.5         3.0     9.0      9600                                                                              2.3  310     13                 1.0       0.2  0.5         10.0    9.5     10200                                                                              2.9  340     14                 1.0       0.2  0.5         12.0    7.0      6400                                                                              12.0 170     4.5                __________________________________________________________________________

As is apparent from the results in Table 22, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ 0.1 to 10.0 wt %, and a forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ of 0.2 to 8.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 9.0 to 10.5 μm and the dielectric loss was 3.0% or less and the apparent dielectric constant was 10000 or more. The riser voltage V.sub. 1 mA of the materials as a varistor was 300 to 400 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 23

The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.4 to 6.0 wt %) was added instead of the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion of Example 2. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 2 and electric characteristics thereof were measured by the same method as Example 2. The results are shown in Table 23.

The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, MoO₃, and MnCO₃, sintering at 900° C. and grinding.

                                      TABLE 23                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     SrO.1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3                                                       growth ZrO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     9.5      9800                                                                              2.5  340     13                 1.0       0.4  6.0         2.0     10.0    10400                                                                              2.3  320     12                 1.0       0.4  1.0         0.2     10.0    10700                                                                              2.4  310     13                 1.0       0.4  1.0         8.0     9.5     10100                                                                              2.1  340     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     10.0    10500                                                                              2.4  330     12                 1.0       0.4  6.0         2.0     10.0    10500                                                                              2.3  310     12                 1.0       0.4  1.0         0.2     9.5     10100                                                                              2.7  330     13                 1.0       0.4  1.0         8.0     10.0    10600                                                                              2.4  320     13                 TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     9.5     10000                                                                              2.5  310     12                 1.0       0.4  6.0         2.0     9.5      9900                                                                              2.8  340     13                 1.0       0.4  1.0         0.2     10.0    10500                                                                              2.7  310     13                 1.0       0.4  1.0         8.0     9.5     10300                                                                              2.8  330     12                 __________________________________________________________________________

As is apparent from the results in Table 23, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte ZrO₂ of 0.2 to 8.0 wt %, and a forming agent of 0.4 to 6.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 22.

EXAMPLE 24

The forming agent 0.8SrO·0.1BaO·0.1CaO·1/3Mn₂ O₃ ·1/3MoO₃ or 0.6SrO·0.2BaO·0.2CaO·1/3Mn₂ O₃ ·1/3MoO₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3))O₃ or Sr₀.6 boundary depletion of Example 3. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, MoO₃, and MnCO₃, sintering at 900° C. and grinding.

The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 3 and electric characteristics thereof were measured by the same method as Example 3. The results are shown in Table 24.

                                      TABLE 24                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth ZrO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       0.8SrO.9.1CaO.0.1BaO                                                                       1.5     9.5      9800                                                                              2.3  340     13                                .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Nb.sub.2 O.sub.5                                                                    0.8SrO.0.1CaO.0.1BaO                                                                       1.5     9.5     10000                                                                              2.4  340     12                           0.05 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       La.sub.2 O.sub.3                                                                    0.8SrO.0.1CaO.0.1BaO                                                                       1.5     9.5     10100                                                                              2.1  340     12                           0.05 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Y.sub.2 O.sub.3                                                                     0.8SrO.0.1CaO.0.1BaO                                                                       1.5     10.0    10500                                                                              2.3  310     11                           0.05 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       WO.sub.3 0.50                                                                       0.6SrO.0.2CaO.0.2BaO                                                                       1.5     9.5      9900                                                                              2.3  340     12                                .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Nb.sub.2 O.sub.5                                                                    0.6 SrO.0.2CaO.0.2BaO                                                                      1.5     10.0    10300                                                                              2.2  310     13                           0.50 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       La.sub.2 O.sub.3                                                                    0.6SrO.0.2CaO.0.2BaO                                                                       1.5     9.5      9800                                                                              2.3  340     12                           0.50 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Y.sub.2 O.sub.3                                                                     0.6SrO.0.2CaO.0.2BaO                                                                       1.5     10.0    10300                                                                              2.9  320     12                           0.50 .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       WO.sub.3 2.0                                                                        0.8SrO.0.1CaO.0.1BaO                                                                       1.5     10.0    10400                                                                              2.5  310     13                                .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Nb.sub.2 O.sub.5                                                                    0.8SrO.0.1CaO.0.1BaO                                                                       1.5     10.0    10500                                                                              2.3  310     12                           2.0  .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       La.sub.2 O.sub.3                                                                    0.8SrO.0.1CaO.0.1BaO                                                                       1.5     9.5      9800                                                                              2.0  340     12                           2.0  .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           3.0       Y.sub.2 O.sub.3                                                                     0.8SrO.0.1CaO.0.1BaO                                                                       1.5     9.5     10000                                                                              2.4  340     11                           2.0  .1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3 2.0                           __________________________________________________________________________

As is apparent from the results in Table 24, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, a semiconducting accelerant of 0.05 to 2.0 wt %, a solid electrolyte ZrO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent 0.8SrO·0.1BaO·0.1CaO·1/3Mn₂ O₃ MoO₃ or 0.6SrO·0.2BaO·0.2CaO·1/3Mn₂ O₃ ·1/3MoO₂ of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 22.

EXAMPLE 25

A sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ (ratio of 20:35:45 wt %) of 0.05 to 6.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Nb₂ O₅ of 0.02 to 3.0 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte CeO₂ of 0.05 to 4.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.1 to 12.0 wt %) to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to strontium titanat (SrTiO₃) obtained by pyrolyzing titanyl strontium oxalate (SrTiO(C₂ O₄)₂ ·4H₂ O) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1300° C. in the air. It was reground in a wet state, made into a paste using resin and organic solutions so as to form a sheet, printed platinum paste for inner electrodes were laminated thereon, sintered at 1400° C. in the air followed by the hydrogen reduction at 1300° C., and heat-treated at 950° C. in the air. Finally, electrodes were adjusted so as to connect inner electrodes with outer electrodes, thereby completing the manufacture of a laminated ceramic capacitor having grain boundary varistor characteristics of FIG. 1. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 25. The sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ (ratio of 20:35:45 wt %) was obtained by weighing commercial TiO₂, Al₂ O₃ and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, MnCO₃ or the like, calcinating at 1000° C., and grinding. The size of the varistor after sintering was approximately 4 mm square and about 0.6 mm in thickness and composed of 8 layers of the dielectrics, each of which was about 70 pm in thickness. The apparent dielectric constant was calculated from the value of the capacitance (measurement 1 kHz) of the laminated varistor. The grain diameter in the sintered body was obtained by examining a cross section after polishing under an optical microscope, to the surface of which Bi₂ O₃ series metallic soap was applied and heat-treated at 1000° C. to make the grain boundary clear.

                                      TABLE 25                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Mn.sub.1/2 Nb.sub.1/2)O.sub.3                                                           growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.0     2400                                                                               11.0 330     4.5                0.1       0.2  0.5         0.8     3.0     3400                                                                               1.2  960     14                 0.5       0.2  0.5         0.8     3.5     4400                                                                               0.9  860     13                 1.0       0.2  0.5         0.8     3.5     3800                                                                               1.0  910     12                 3.0       0.2  0.5         0.8     3.0     3600                                                                               1.1  1040    13                 5.0       0.2  0.5         0.8     3.0     3200                                                                               1.0  980     14                 6.0       0.2  0.5         0.8     3.0     3300                                                                               1.2  1020    13                 1.0       0.02 0.5         0.8     3.5     2100                                                                               19.0 850     3.0                1.0       0.05 0.5         0.8     3.0     3500                                                                               1.3  970     14                 1.0       0.5  0.5         0.8     3.0     3100                                                                               0.9  1130    13                 1.0       2.0  0.5         0.8     3.5     4000                                                                               1.0  880     14                 1.0       3.0  0.5         0.8     3.0     2100                                                                               18.0 1030    6.0                1.0       0.2  0.1         0.8     3.0     2400                                                                               12.5 1010    3.5                1.0       0.2  0.2         0.8     3.5     3900                                                                               1.2  860     14                 1.0       0.2  1.0         0.8     3.0     3100                                                                               1.1  1140    12                 1.0       0.2  3.0         0.8     3.5     4100                                                                               1.0  870     11                 1.0       0.2  10.0        0.8     3.0     3600                                                                               1.1  970     12                 1.0       0.2  12.0        0.8     2.0     1300                                                                               5.5  350     6.0                1.0       0.2  0.5         0.05    2.5     1800                                                                               12.5 320     4.0                1.0       0.2  0.5         0.1     3.0     3200                                                                               1.4  990     13                 1.0       0.2  0.5         0.5     3.5     4400                                                                               1.1  910     13                 1.0       0.2  0.5         1.0     3.0     3400                                                                               1.0  930     12                 1.0       0.2  0.5         3.0     3.0     3100                                                                               1.0  1130    13                 1.0       0.2  0.5         4.0     2.0     2100                                                                               12.5 350     5.0                __________________________________________________________________________

As is apparent from the results in Table 25, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt %, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ of 0.2 to 10.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.0 to 3.5 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 3,000 or more. The riser voltage V₁ mA of the materials as a varistor was 850 to 1150 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 26

A sintering accelerant of 1.0 wt % selected from TiO₂ -MgO-SiO₀₂ series (for example, ratio of 30:30:40 wt %), TiO₂ -MnO-SiO₂ series (for example, ratio of 10:50:40 wt %), TiO₂ -Al₂ O₃ -SiO₂ series (for example, ratio of 20:35:45 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.04 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ of 0.4 to 8.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molded like a disk shape, sintered at 1380° C. in a reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and silver electrodes were formed on both sides of the disk, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 26.

The sintering accelerant, for example TiO₂ -MgO-SiO₂ series (for example, ratio of 30:30:40 wt %), was obtained by weighing commercial TiO₂, MgO and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 26                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     SrO(Mn.sub.1/2 Nb.sub.1/2)O.sub.3                                                          growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.0     3100                                                                               1.2  1120    13                 1.0       0.4  8.0         1.0     3.0     3300                                                                               1.4  950     12                 1.0       0.4  1.0         0.2     3.0     3200                                                                               1.1  1050    13                 1.0       0.4  1.0         2.0     3.0     3500                                                                               1.1  990     14                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     3800                                                                               1.3  890     12                 1.0       0.4  8.0         1.0     3.0     3400                                                                               1.2  1020    11                 1.0       0.4  1.0         0.2     3.5     4000                                                                               1.2  910     12                 1.0       0.4  1.0         2.0     3.0     3300                                                                               1.0  930     12                 TIO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.0     3400                                                                               0.9  960     13                 1.0       0.4  8.0         1.0     3.5     3900                                                                               1.1  880     12                 1.0       0.4  1.0         0.2     3.5     4200                                                                               0.9  860     13                 1.0       0.4  1.0         2.0     3.0     3300                                                                               1.2  930     12                 __________________________________________________________________________

As is apparent from the results in Table 26, the present material obtained by adding SrTiO₂ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt %, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 3.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 25.

EXAMPLE 27

A sintering accelerant of 3.0 wt % of TiO₂ -MgO-SiO₂ series (for example, ratio of 30:30:40 wt %) mainly forming a liquid phase at a high temperature, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a good oxygen conductive solid electrolyte CeO₂ of 1.5 wt % which functions as a control agent to control the grain growth, and a forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(1/2) Nb_(1/2))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and electrodes were formed, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 27.

The sintering accelerant TiO₂ -MgO_(SiO) ₂ series (ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Nb₂ O₅ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 27                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4100                                                                               1.0  880     14                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3200                                                                               1.2  960     13                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3300                                                                               1.2  1010    13                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub. 0.1                                                          1.5     3.5     3800                                                                               1.4  860     12                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3400                                                                               1.3  970     13                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.6                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4000                                                                               1.2  870     12                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3600                                                                               1.2  950     14                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3300                                                                               1.0  1020    13                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4200                                                                               1.0  900     14                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.2  980     14                           2.0  (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3200                                                                               1.2  910     13                           2.0  (Mn.sub. 1/2 Nb.sub.1/2)O.sub.3 2.0                             3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3900                                                                               1.4  680     12                           2.0  (MN.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 27, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 25.

EXAMPLE 28

A capacitor was manufactured according to the method in Example 25 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Mn_(1/2) Ta_(1/2))O₃ (0.1 to 12.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.1 to 12.0 wt %) to form a grain boundary depletion both of which also function as a control agent to control the grain growth and electric characteristics thereof were measured by the same method as Example 25.

The results are shown in Table 28.

The forming agent Sr(Mn_(1/2) Ta_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Ta₂ O₅, MnCO₃ or the like, sintering at 1000° C. and grinding.

                                      TABLE 28                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Mn.sub.1/2 Ta.sub.1/2)O.sub.3                                                           growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.0     3500                                                                               23.0 350     3.5                0.1       0.2  0.5         0.8     3.5     3600                                                                               1.8  910     11                 0.5       0.2  0.5         0.8     3.0     3300                                                                               1.7  960     12                 1.0       0.2  0.5         0.8     3.5     3900                                                                               0.5  830     13                 3.0       0.2  0.5         0.8     3.5     4200                                                                               1.4  880     12                 5.0       0.2  0.5         0.8     4.0     4600                                                                               1.1  800     12                 6.0       0.2  0.5         0.8     4.0     4700                                                                               1.3  760     12                 1.0       0.02 0.5         0.8     2.0     2500                                                                               33.0 420     6.0                1.0       0.05 0.5         0.8     3.5     4300                                                                               1.6  890     11                 1.0       0.5  0.5         0.8     3.0     3600                                                                               1.3  980     12                 1.0       2.0  0.5         0.8     3.5     3700                                                                               1.7  860     11                 1.0       3.0  0.5         0.8     2.0     2200                                                                               18.5 260     5.5                1.0       0.2  0.1         0.8     3.0     2700                                                                               25.5 310     4.5                1.0       0.2  0.2         0.8     3.0     3300                                                                               1.9  940     11                 1.0       0.2  1.0         0.8     3.5     3900                                                                               1.4  810     12                 1.0       0.2  3.0         0.8     4.0     5100                                                                               1.3  770     13                 1.0       0.2  10.0        0.8     3.5     4100                                                                               1.8  870     13                 1.0       0.2  12.0        0.8     2.5     2700                                                                               20.5 400     4.5                1.0       0.2  0.5         0.05    4.0     2500                                                                               17.7 280     5.0                1.0       0.2  0.5         0.1     3.5     4400                                                                               1.7  830     12                 1.0       0.2  0.5         0.5     3.5     3800                                                                               1.7  890     12                 1.0       0.2  0.5         1.0     3.5     4200                                                                               1.4  810     13                 1.0       0.2  0.5         3.0     3.0     3400                                                                               1.3  980     11                 1.0       0.2  0.5         4.0     2.5     2500                                                                               18.8 320     4.0                __________________________________________________________________________

As is apparent from the results in Table 28, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt % which also functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Ta_(1/2))O₃ of 0.2 to 10.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.0 to 3.5 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 3000 or more. The riser voltage V₁ mA of the materials as a varistor was 750 to 1000 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the non-linearity resistive charac-teristics in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 29

A capacitor was manufactured according to the method in Example 26 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Mn_(1/2) Ta_(1/2))O₃ (0.4 to 8.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.4 to 8.0 wt %) to form a grain boundary depletion both of which also function as control agents to control grain growth and electric characteristics thereof was measured by the same method as Example 26. The results are shown in Table 29. The forming agent Sr(Mn_(1/2) Ta_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control grain growth was obtained by mixing commercial SrCO₃, Ta₂ O₅, MnCO₃ or the like, sintering at 900° C. and grinding.

                                      TABLE 29                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Mn.sub.1/2 Ta.sub.1/2)O.sub.3                                                           growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.5     4200                                                                               1.4  850     12                 1.0       0.4  8.0         1.0     3.5     4000                                                                               1.5  890     12                 1.0       0.4  1.0         0.2     4.0     4900                                                                               1.6  790     11                 1.0       0.4  1.0         2.0     3.0     3400                                                                               1.3  920     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     3800                                                                               1.7  830     12                 1.0       0.4  8.0         1.0     3.5     4100                                                                               1.4  880     11                 1.0       0.4  1.0         0.2     3.5     4200                                                                               1.4  900     11                 1.0       0.4  1.0         2.0     3.5     3900                                                                               1.6  830     11                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     4800                                                                               1.3  800     12                 1.0       0.4  8.0         1.0     3.5     3700                                                                               1.6  850     12                 1.0       0.4  1.0         0.2     4.0     5000                                                                               1.7  780     11                 1.0       0.4  1.0         2.0     3.5     4200                                                                               1.7  870     12                 __________________________________________________________________________

As is apparent from the results in Table 29, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 8.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 28.

EXAMPLE 30

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(1/2) Ta_(1/2)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(1/2) Nb_(1/2)) or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % to form a grain boundary depletion of Example 27. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 27 and electric characteristics thereof were measured by the same method as Example 27. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Ta₂ O₅, and MnCO₃ sintering at 900° C. and grinding.

                                      TABLE 30                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     5000                                                                               1.2  790     12                                (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4200                                                                               1.2  820     13                           0.05 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3800                                                                               1.3  870     13                           0.05 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3400                                                                               1.4  940     12                           0.05 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4800                                                                               1.3  800     11                                (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.6                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4100                                                                               1.3  840     13                           0.50 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     3700                                                                               1.6  810     11                           0.50 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4900                                                                               1.5  790     12                           0.50 (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4300                                                                               1.2  830     12                                (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4700                                                                               1.2  770     13                           2.0  (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3800                                                                               1.3  870     13                           2.0  (Mn.sub.1/2 Ta.sub.1/2 )O.sub.3 2.0                             3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.4  920     12                           2.0  (Mn.sub.1/2 Ta.sub.1/2)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 30, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 28.

EXAMPLE 31

A capacitor was manufactured according to the method in Example 25 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/2) W_(1/2))O₃ (0.1 to 6.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.1 to 12.0 wt %) to form a grain boundary depletion and electric characteristics thereof were measured by the same method as Example 25. The results are shown in Table 31. The forming agent Sr(Cu_(1/2) W_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃, CuO or the like, sintering at 1000° C. and grinding.

                                      TABLE 31                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/2 W.sub.1/2)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.5     1800                                                                               18.0 460     2.5                0.1       0.2  0.5         0.8     3.5     4200                                                                               1.9  880     12                 0.5       0.2  0.5         0.8     3.5     4000                                                                               0.5  900     12                 1.0       0.2  0.5         0.8     3.0     3600                                                                               0.5  940     13                 3.0       0.2  0.5         0.8     3.5     4100                                                                               1.7  900     13                 5.0       0.2  0.5         0.8     3.5     4100                                                                               1.6  850     12                 6.0       0.2  0.5         0.8     3.5     3800                                                                               1.8  870     12                 1.0       0.02 0.5         0.8     3.0     2500                                                                               25.0 340     3.5                1.0       0.05 0.5         0.8     3.0     3300                                                                               1.8  910     13                 1.0       0.5  0.5         0.8     3.0     3100                                                                               0.5  950     13                 1.0       2.0  0.5         0.8     3.5     3900                                                                               0.5  830     12                 1.0       3.0  0.5         0.8     3.5     2500                                                                               17.0 330     4.5                1.0       0.2  0.1         0.8     3.5     2200                                                                               22.0 430     4.0                1.0       0.2  0.2         0.8     3.5     4200                                                                               1.6  870     11                 1.0       0.2  0.5         0.8     3.0     3500                                                                               1.4  970     12                 1.0       0.2  2.0         0.8     3.5     4100                                                                               1.6  850     12                 1.0       0.2  5.0         0.8     3.0     3500                                                                               1.8  980     13                 1.0       0.2  6.0         0.8     3.0     2400                                                                               18.0 530     4.5                1.0       0.2  0.5         0.05    3.5     2800                                                                               17.0 310     2.5                1.0       0.2  0.5         0.1     3.5     4000                                                                               1.8  890     11                 1.0       0.2  0.5         0.5     3.0     3200                                                                               1.7  980     12                 1.0       0.2  0.5         1.0     3.0     3500                                                                               1.7  930     12                 1.0       0.2  0.5         3.0     3.0     3300                                                                               0.5  910     11                 1.0       0.2  0.5         4.0     2.5     2700                                                                               10.0 280     3.5                __________________________________________________________________________

As is apparent from the results in Table 31, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt %, and a forming agent Sr(Cu_(1/2) W_(1/2))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.0 to 3.5 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 3,000 or more. The riser voltage V₁ mA of the materials as a varistor was 800 to 1000 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₂ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 32

A capacitor was manufactured according to the method in Example 26 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/2) W_(1/2))O₃ (0.4 to 4.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.4 to 8.0 wt %) to form a grain boundary depletion and electric characteristics thereof were measured by the same method as Example 26. The results are shown in Table 32. The forming agent Sr(Cu_(1/2) W_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃ and CuO, sintering at 900° C. and grinding.

                                      TABLE 32                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Cu.sub.1/2 W.sub.1/2)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     3.0     3500                                                                               1.6  920     12                 1.0       0.4  4.0         2.0     3.5     4200                                                                               0.5  840     12                 1.0       0.4  1.0         0.2     3.5     4100                                                                               1.4  870     13                 1.0       0.4  1.0         1.0     3.0     3600                                                                               0.5  940     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     3.5     3800                                                                               1.4  890     12                 1.0       0.4  4.0         2.0     3.0     3300                                                                               1.4  990     13                 1.0       0.4  1.0         0.2     3.5     4000                                                                               1.3  820     12                 1.0       0.4  1.0         1.0     3.0     3400                                                                               1.6  980     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     3.5     4100                                                                               0.5  850     13                 1.0       0.4  4.0         2.0     3.5     4400                                                                               1.3  880     12                 1.0       0.4  1.0         0.2     3.5     3900                                                                               1.4  900     12                 1.0       0.4  1.0         1.0     3.0     3600                                                                               1.2  950     12                 __________________________________________________________________________

As is apparent from the results in Table 32, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 31.

EXAMPLE 33

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/2) W_(1/2)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/2) W_(1/2))03 of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(1/2) Nb_(1/2)) or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % to form a grain boundary depletion of Example 27. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 27 and electric characteristics thereof were measured by the same method as Example 27. The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, WO₃ and CuO, sintering at 900° C. and grinding. The results are shown in Table 33.

                                      TABLE 33                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3400                                                                               1.3  930     12                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3600                                                                               1.6  970     12                           0.05 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3900                                                                               0.5  890     11                           0.05 9Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.2  910     12                           0.05 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4300                                                                               1.2  870     13                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3300                                                                               1.2  950     11                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3600                                                                               1.1  930     13                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4000                                                                               1.3  860     12                           0.50 (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3400                                                                               1.3  970     13                                (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.6  930     13                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4100                                                                               0.5  890     11                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3300                                                                               1.2  910     12                           2.0  (Cu.sub.1/2 W.sub.1/2)O.sub.3 2.0                               __________________________________________________________________________

As is apparent from the results in Table 33, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 31.

EXAMPLE 34

A capacitor was manufactured according to the method in Example 25 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Co_(1/2) W_(1/2))O₃ (0.1 to 6.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.1 to 12.0 wt %) to form a grain boundary depletion both of which also function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 25. The results are shown in Table 34.

The forming agent Sr(Co_(1/2) W_(1/2))O₃ to form grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃, CoO or the like, sintering at 1000° C. and grinding.

                                      TABLE 34                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Co.sub.1/2 W.sub.1/2)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  (μm) ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     1.0     1300                                                                               27.5 330     3.5                0.1       0.2  0.5         0.8     3.0     3200                                                                               1.7  950     11                 0.5       0.2  0.5         0.8     3.5     3800                                                                               1.6  910     12                 1.0       0.2  0.5         0.8     3.5     4000                                                                               0.5  870     11                 3.0       0.2  0.5         0.8     3.5     4100                                                                               1.7  860     12                 5.0       0.2  0.5         0.8     3.5     4100                                                                               1.7  890     11                 6.0       0.2  0.5         0.8     3.5     4300                                                                               1.4  900     12                 1.0       0.02 0.5         0.8     3.5     3300                                                                               24.0 240     2.5                1.0       0.05 0.5         0.8     3.5     3900                                                                               1.7  890     11                 1.0       0.5  0.5         0.8     3.0     3400                                                                               1.6  980     12                 1.0       2.0  0.5         0.8     3.5     4200                                                                               1.6  870     12                 1.0       3.0  0.5         0.8     3.5     3100                                                                               20.5 270     3.5                1.0       0.2  0.1         0.8     3.5     3200                                                                               17.5 330     5.5                1.0       0.2  0.2         0.8     3.5     4200                                                                               1.7  860     11                 1.0       0.2  0.5         0.8     3.0     3600                                                                               0.5  960     12                 1.0       0.2  2.0         0.8     3.0     3500                                                                               1.6  990     11                 1.0       0.2  5.0         0.8     3.0     3400                                                                               1.7  920     12                 1.0       0.2  6.0         0.8     2.5     2800                                                                               12.5 550     5.5                1.0       0.2  0.5         0.05    3.5     3100                                                                               17.0 490     4.0                1.0       0.2  0.5         0.1     3.5     4400                                                                               1.6  870     11                 1.0       0.2  0.5         0.5     3.5     4100                                                                               1.6  910     12                 1.0       0.2  0.5         1.0     3.5     4300                                                                               1.7  900     11                 1.0       0.2  0.5         3.0     3.0     3600                                                                               1.6  960     11                 1.0       0.2  0.5         4.0     2.0     2200                                                                               15.0 460     6.5                __________________________________________________________________________

As is apparent from the results in Table 34, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt % which also functions as a control agent to control the grain growth, and a forming agent Sr(Co_(1/2) W_(1/2))O of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.0 to 3.5 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 3,000 or more. The riser voltage V₁ mA of the materials as a varistor was 850 to 1000 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 35

A capacitor was manufactured according to the method in Example 26 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Co_(1/2) W_(1/2))O₃ (0.4 to 4.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.4 to 8.0 wt %) to form a grain boundary depletion both of which function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 26. The results are shown in Table 35.

The forming agent Sr(Co_(1/2) W_(1/2))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃ and CoO, sintering at 900° C. and grinding.

                                      TABLE 35                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/2 W.sub.1/2)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         2.0     3.0     3400                                                                               1.4  940     11                 1.0       0.4  4.0         2.0     3.5     3900                                                                               0.5  910     12                 1.0       0.4  1.0         0.2     3.5     4100                                                                               1.7  880     11                 1.0       0.4  1.0         1.0     3.0     3600                                                                               0.5  920     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     3.5     4000                                                                               1.6  860     11                 1.0       0.4  4.0         2.0     3.0     3400                                                                               1.7  930     11                 1.0       0.4  1.0         0.2     3.5     4200                                                                               1.7  840     12                 1.0       0.4  1.0         1.0     3.0     3600                                                                               1.8  990     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         2.0     3.5     3800                                                                               0.5  890     12                 1.0       0.4  4.0         2.0     3.5     4200                                                                               1.6  910     11                 1.0       0.4  1.0         0.2     3.5     4000                                                                               1.8  860     11                 1.0       0.4  1.0         1.0     3.0     3500                                                                               1.8  970     11                 __________________________________________________________________________

As is apparent from the results in Table 35, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 34.

EXAMPLE 36

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Co_(1/2) W_(1/2)) O₃ or Sr₀.8 Ba₀.2 Ca₀.2 (Co_(1/2) W_(1/2))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (M_(1/2) Nb_(1/2))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % to form a grain boundary depletion all of which function as control agents to control the grain growth of Example 27. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 27 and electric characteristics thereof were measured by the same method as Example 27.

The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, WO₃ and CoO, sintering at 900° C. and grinding.

The results are shown in Table 36.

                                      TABLE 36                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4100                                                                               1.2  870     12                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3900                                                                               1.1  900     13                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3600                                                                               1.2  960     13                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub. 0.1                                                          1.5     3.0     3500                                                                               1.3  920     12                           0.05 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4000                                                                               0.5  870     13                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3400                                                                               1.6  990     13                           0.50 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4300                                                                               0.5  890     11                           0.50 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4200                                                                               1.6  870     13                           0.50 (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4100                                                                               1.2  900     12                                (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3900                                                                               1.1  880     13                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3600                                                                               1.2  940     13                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.3  950     12                           2.0  (Co.sub.1/2 W.sub.1/2)O.sub.3 2.0                               __________________________________________________________________________

As is apparent from the results in Table 36, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 34.

EXAMPLE 37

A capacitor was manufactured according to the method in Example 25 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 5.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.1 to 12.0 wt %) to form a grain boundary depletion both of which function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 25. The results are shown in Table 37. The forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, CuO or the like, sintering at 1000° C. and grinding.

                                      TABLE 37                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     2.0     2200                                                                               15.0 220     3.0                0.1       0.2  0.5         0.8     3.5     3800                                                                               1.6  860     11                 0.5       0.2  0.5         0.8     4.0     4700                                                                               1.4  730     12                 1.0       0.2  0.5         0.8     3.5     3900                                                                               1.0  840     12                 3.0       0.2  0.5         0.8     4.0     4800                                                                               0.8  780     11                 5.0       0.2  0.5         0.8     4.0     5200                                                                               1.0  790     11                 6.0       0.2  0.5         0.8     4.0     5100                                                                               1.2  770     12                 1.0       0.02 0.5         0.8     2.5     2300                                                                               26.0 150     4.0                1.0       0.05 0.5         0.8     3.5     4100                                                                               0.5  810     11                 1.0       0.5  0.5         0.8     4.0     4800                                                                               0.7  750     12                 1.0       2.0  0.5         0.8     3.5     4400                                                                               1.2  890     12                 1.0       3.0  0.5         0.8     2.0     2000                                                                               19.0 320     6.5                1.0       0.2  0.1         0.8     2.5     2300                                                                               17.5 300     4.0                1.0       0.2  0.2         0.8     3.5     4100                                                                               1.7  890     12                 1.0       0.2  0.5         0.8     4.0     4600                                                                               0.9  770     13                 1.0       0.2  2.0         0.8     3.5     4400                                                                               1.0  870     12                 1.0       0.2  4.0         0.8     4.0     4800                                                                               1.6  780     12                 1.0       0.2  6.0         0.8     2.5     2400                                                                               18.5 550     3.0                1.0       0.2  0.5         0.05    3.0     3100                                                                               22.0 330     4.5                1.0       0.2  0.5         0.1     4.0     4700                                                                               1.7  770     11                 1.0       0.2  0.5         0.5     3.5     4100                                                                               1.0  860     12                 1.0       0.2  0.5         1.0     3.5     4200                                                                               1.2  830     11                 1.0       0.2  0.5         3.0     3.5     3800                                                                               1.8  810     11                 1.0       0.2  0.5         4.0     2.5     2200                                                                               17.0 250     5.0                __________________________________________________________________________

As is apparent from the results in Table 37, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt % which also functions as a control agent to control the grain growth, and a forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ of 0.2 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.5 to 4.0 μm and the dielectric loss was 2.0% or less and the apparent dielectric constant was 3500 or more. The riser voltage V₁ mA of the materials as a varistor was 700 to 900 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained.

When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 38

A capacitor was manufactured according to the method in Example 26 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 3.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.4 to 3.0 wt %) to form a grain boundary depletion both of which function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 26. The results are shown in Table 38.

The forming agent Sr(Cu Nb )O to form a grain boundary depletion was obtained by mixing commercial SrCO , Nb O , and CuO, sintering at 900° C. and grinding.

                                      TABLE 38                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     4.0     4800                                                                               1.2  770     12                 1.0       0.4  3.0         1.0     4.0     4700                                                                               1.4  760     11                 1.0       0.4  1.0         0.2     3.5     4400                                                                               1.3  830     12                 1.0       0.4  1.0         2.0     4.0     4600                                                                               1.6  730     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     5100                                                                               1.1  770     12                 1.0       0.4  3.0         1.0     3.5     4100                                                                               1.3  810     13                 1.0       0.4  1.0         0.2     3.5     4300                                                                               1.4  820     12                 1.0       0.4  1.0         2.0     4.0     4800                                                                               1.2  790     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     4200                                                                               1.0  820     11                 1.0       0.4  3.0         1.0     4.0     4800                                                                               1.5  780     12                 1.0       0.4  1.0         0.2     4.0     5000                                                                               1.4  740     11                 1.0       0.4  1.0         2.0     4.0     5100                                                                               1.2  770     12                 __________________________________________________________________________

As is apparent from the results in Table 38, the present material obtained by adding SrTiO₂ to a sintering accelerant such as TiO₂ -MgO-SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 3.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 37.

EXAMPLE 39

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn₁₇₈ Nb_(1/2))O₃ or Sr₀.6 Ba₀.1 Ca₀.1 (Mn_(1/2) Nb_(2/3))O₃ of 2.0 wt % to form a grain boundary depletion all of which function as control agents to control the grain growth of Example 27. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 27 and electric characteristics thereof were measured by the same method as Example 27.

The forming agent to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Nb₂ O₅, and CuO, sintering at 900° C. and grinding.

The results are shown in Table 39.

                                      TABLE 39                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4800                                                                               1.2  750     12                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4300                                                                               1.2  810     12                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4900                                                                               1.2  760     13                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub. 0.1                                                          1.5     4.0     4700                                                                               1.1  790     13                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4100                                                                               1.3  830     11                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4600                                                                               1.3  790     12                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4700                                                                               1.6  770     12                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4600                                                                               1.5  790     11                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4800                                                                               1.2  750     13                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4200                                                                               1.2  810     12                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4900                                                                               1.2  760     12                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4400                                                                               1.1  850     13                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 39, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ -MgO-SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 37.

A sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ (ratio of 20:30:45 wt %) of 0.05 to 6.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Nb₂ O₅ of 0.02 to 3.0 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte Pr₆ O₁₁ of 0.05 to 5.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ (0.1 to 12.0 wt %) to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to strontium titanat (SrTiO₃) obtained by pyrolyzing titanyl strontium oxalate (SrTiO(C₂ O₄)₂ ·4H₂ O) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1300° C. in the air. It was reground in a wet state, made paste using resin and organic solutions so as to form a sheet, printed platinum paste for inner electrodes were laminated theron, sintered at 1400° C. in the air followed by the hydrogen reduction at 1300° C., and heat-treated at 950° C. in the air. Finally, electrodes were adjusted so as to connect inner electrodes with outer electrodes, thereby completing the manufacture of a laminated ceramic capacitor having grain boundary varistor characteristics of FIG. 1. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 40. The sintering accelerant TiO₂ -Al₂ O₃ -SiO₂ (ratio of 20:30:45 wt %) was obtained by weighing commercial TiO₂, Al₂ O₃ and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅, MnCO₃ or the like, calcinating at 1000° C., and grinding. The size of the varistor after sintering was approximately 4 mm square and about 0.6 mm in thickness and composed of 8 layers of the dielectrics each of which was about 70 μm in thickness. The apparent dielectric constant ε was calculated from the value of the capacitance (measurement 1 kHz) of the laminated varistor. The grain diameter in the sintered body was obtained by examining a cross section after polishing under an optical microscope, to the surface of which Bi₂ O₃ series metallic soap was applied and heat-treated at 1000° C. to make the grain boundary clear.

                                      TABLE 40                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Mn.sub.1/2 Nb.sub.1/2)O.sub.3                                                           growth Pr.sub.6 O.sub.11                                                               mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     1.5     2800                                                                               28.0 220     3.0                0.1       0.2  0.5         0.8     3.5     4400                                                                               2.9  820     11                 0.5       0.2  0.5         0.8     3.5     4500                                                                               2.4  840     11                 1.0       0.2  0.5         0.8     3.5     4200                                                                               2.6  820     12                 3.0       0.2  0.5         0.8     4.0     4900                                                                               2.2  770     12                 5.0       0.2  0.5         0.8     4.0     4800                                                                               2.5  780     11                 6.0       0.2  0.5         0.8     4.0     4800                                                                               2.5  760     11                 1.0       0.02 0.5         0.8     3.5     4300                                                                               31.0 270     5.0                1.0       0.05 0.5         0.8     3.5     4200                                                                               2.3  820     12                 1.0       0.5  0.5         0.8     4.0     4600                                                                               2.6  770     12                 1.0       2.0  0.5         0.8     3.5     4400                                                                               2.1  800     11                 1.0       3.0  0.5         0.8     2.0     3700                                                                               22.4 270     4.0                1.0       0.2  0.1         0.8     3.5     4500                                                                               17.4 250     3.5                1.0       0.2  0.2         0.8     4.0     4700                                                                               2.8  760     12                 1.0       0.2  1.0         0.8     4.0     4800                                                                               2.4  750     11                 1.0       0.2  3.0         0.8     3.5     4400                                                                               2.3  810     11                 1.0       0.2  10.0        0.8     3.5     4200                                                                               2.5  830     12                 1.0       0.2  12.0        0.8     2.5     2800                                                                               19.2 280     4.5                1.0       0.2  0.5         0.05    3.5     4200                                                                               24.3 810     6.5                1.0       0.2  0.5         0.1     4.0     4800                                                                               2.3  790     11                 1.0       0.2  0.5         0.5     4.0     4800                                                                               2.2  780     12                 1.0       0.2  0.5         2.0     3.5     4200                                                                               2.7  820     12                 1.0       0.2  0.5         4.0     3.5     4100                                                                               2.4  800     11                 1.0       0.2  0.5         5.0     2.0     3200                                                                               14.2 320     4.5                __________________________________________________________________________

As is apparent from the results in Table 40, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₃ -Al₂ O₃ -SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte Pr₆ O₁₁ 0.1 to 4.0 wt %, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ of 0.2 to 10.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.5 to 4.0 μm and the dielectric loss was 3.0% or less and the apparent dielectric constant was 4,000 or more. The riser voltage V.sub. 1 mA of the materials as a varistor was 750 to 850 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between v₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it not practical.

EXAMPLE 41

A sintering accelerant of 1.0 wt % selected from TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %), TiO₂ --MnO--SiO₂ series (for example, ratio of 10:50:40 wt %), TiO₂ --Al₂ O₃ --SiO₂ series (for example, ratio of 20:35:45 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.04 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte Pr₆ O₁₁ of 0.2 to 3.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ of 0.4 to 0.8 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ of 0.4 to 0.8 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molded into a disk shape, sintered at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and silver electrodes were formed on both sides of the disk, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 41. The sintering accelerant, for example, TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 120° C., and grinding. The forming agent Sr(Mn_(1/2) Nb_(1/2))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, Nb₂ O₅ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 41                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Mn.sub.1/2 Nb.sub.1/2)O.sub.3                                                           growth Pr.sub.6 O.sub.11                                                               mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.5     4300                                                                               2.7  800     12                 1.0       0.4  8.0         1.0     3.5     4200                                                                               2.4  810     12                 1.0       0.4  1.0         0.2     4.0     4800                                                                               2.7  760     11                 1.0       0.4  1.0         3.0     3.5     4500                                                                               2.1  830     12                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     4800                                                                               2.3  780     11                 1.0       0.4  8.0         1.0     3.5     4300                                                                               2.5  840     12                 1.0       0.4  1.0         0.2     4.0     4600                                                                               2.2  780     11                 1.0       0.4  1.0         3.0     3.5     4300                                                                               2.2  820     11                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     4700                                                                               2.3  790     12                 1.0       0.4  8.0         1.0     4.0     4600                                                                               2.7  760     11                 1.0       0.4  1.0         0.2     4.0     4700                                                                               2.5  770     12                 1.0       0.4  1.0         3.0     3.5     4400                                                                               2.3  830     11                 __________________________________________________________________________

As is apparent from the results in Table 41, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte Pr₆ O₁₁ of 0.2 to 3.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 8.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 40.

EXAMPLE 42

A sintering accelerant of 3.0 wt % of TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %) mainly forming a liquid phase at a high temperature, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a good oxygen conductive solid electrolyte Pr₆ O₁₁ of 1.5 wt % which functions as a control agent to control the grain growth, and a forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(1/2) Nb_(1/2))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and electrodes were formed, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 42.

The sintering accelerant TiO₂ --MgO--SiO₂ series (ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Nb₂ O₅ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 42                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth Pr.sub.6 O.sub.11                                                               mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4700                                                                               2.8  780     12                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4300                                                                               2.7  810     12                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4800                                                                               2.7  790     13                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub. 0.1 Ca.sub.0.1                                                          1.5     3.5     4300                                                                               2.6  840     11                           0.05 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4800                                                                               2.3  790     12                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 ca.sub.0.2                                                           1.5     3.5     4500                                                                               2.4  830     11                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4400                                                                               2.5  820     12                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4400                                                                               2.4  810     11                           0.50 (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4300                                                                               2.4  830     12                                (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4400                                                                               2.3  810     13                           2.0  (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4600                                                                               2.6  790     13                           2.0  (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4300                                                                               2.4  820     11                           2.0  (Mn.sub.1/2 Nb.sub.1/2)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 42, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte Pr₆ O₁₁ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 40.

EXAMPLE 43

A capacitor was manufactured according to the method in Example 40 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.1 to 6.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.1 to 12.0 wt %) to form a grain boundary depletion both of which also function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 40. The results are shown in Table 43. The forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion was obtained by mixing commercial SrCO₃, Nb₂ O₅, CuO or the like, sintering at 1000° C. and grinding.

                                      TABLE 43                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Cu.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth Pr.sub.6 O.sub.11                                                               mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  0.5         0.8     1.2     1500                                                                               55.0 250     5.0                0.1       0.2  0.5         0.8     3.0     3600                                                                               2.6  940     12                 0.5       0.2  0.5         0.8     3.0     3600                                                                               2.2  920     13                 1.0       0.2  0.5         0.8     3.5     3900                                                                               1.8  860     13                 3.0       0.2  0.5         0.8     3.5     3700                                                                               1.8  830     12                 5.0       0.2  0.5         0.8     3.5     3800                                                                               1.7  860     13                 6.0       0.2  0.5         0.8     3.5     3700                                                                               1.7  840     13                 1.0       0.02 0.5         0.8     1.2     2500                                                                               25.0 310     5.0                1.0       0.05 0.5         0.8     3.0     3600                                                                               2.2  920     12                 1.0       0.5  0.5         0.8     3.5     3900                                                                               1.8  850     13                 1.0       2.0  0.5         0.8     3.5     3800                                                                               1.7  870     12                 1.0       3.0  0.5         0.8     3.0     3400                                                                               25.0 400     4.5                1.0       0.2  0.1         0.8     3.0     3100                                                                               32.5 380     3.5                1.0       0.2  0.2         0.8     3.5     3900                                                                               2.8  880     11                 1.0       0.2  1.0         0.8     3.0     3600                                                                               1.1  900     12                 1.0       0.2  3.0         0.8     3.5     3800                                                                               1.9  890     13                 1.0       0.2  5.0         0.8     3.5     3900                                                                               1.8  860     11                 1.0       0.2  6.0         0.8     3.5     2700                                                                               17.0 320     5.5                1.0       0.2  0.5         0.05    3.0     3300                                                                               17.7 430     4.0                1.0       0.2  0.5         0.1     3.5     3700                                                                               2.2  850     13                 1.0       0.2  0.5         0.5     3.5     3800                                                                               1.7  880     12                 1.0       0.2  0.5         2.0     3.5     3700                                                                               1.9  830     13                 1.0       0.2  0.5         4.0     3.0     3600                                                                               1.1  900     11                 1.0       0.2  0.5         5.0     2.0     2700                                                                               12.5 330     5.0                __________________________________________________________________________

As is apparent from the results in Table 43, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte Pr₆ O₁₁ 0.1 to 4.0 wt % which also functions as a control agent to control the grain growth, and a forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3 0 to 3.5 μm and the dielectric loss was 3.0% or less and the apparent dielectric constant was 3,500 or more. The riser voltage V₁ mA of the materials as a varistor was 800 to 950 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 44

A capacitor was manufactured according to the method in Example 41 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ (0.4 to 4.0 wt %) was used instead of the forming agent Sr(Mn_(1/2) Nb_(1/2)) (0.4 to 8.0 wt %) to form a grain boundary depletion both of which also function as control agents to control the grain growth and electric characteristics thereof were measured by the same method as Example 41. The results are shown in Table 44. The forming agent Sr(Cu_(1/3) Nb_(2/3))O₃ to form a grain boundary depletion was obtained by mixing commercial SrCO₃, Nb₂ O₅ and CuO, sintering at 900° C. and grinding.

                                      TABLE 44                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Co.sub.1/3 Nb.sub.2/3)O.sub.3                                                           growth Pr.sub.6 O.sub.11                                                               mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.5     3800                                                                               1.2  890     12                 1.0       0.4  4.0         1.0     3.0     3600                                                                               1.4  950     12                 1.0       0.4  1.0         0.2     3.5     3800                                                                               1.2  840     12                 1.0       0.4  1.0         3.0     3.0     3500                                                                               1.0  930     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     3900                                                                               1.8  870     13                 1.0       0.4  4.0         1.0     3.5     3700                                                                               1.8  880     12                 1.0       0.4  1.0         0.2     3.5     3800                                                                               1.9  880     12                 1.0       0.4  1.0         3.0     3.0     3500                                                                               1.7  910     13                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     3800                                                                               0.8  890     13                 1.0       0.4  4.0         1.0     3.5     3700                                                                               0.8  880     12                 1.0       0.4  1.0         0.2     3.5     3600                                                                               0.9  850     11                 1.0       0.4  1.0         3.0     3.0     3500                                                                               0.9  900     12                 __________________________________________________________________________

As is apparent from the results in Table 44, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte Pr₆ O₁₁ of 0.2 to 3.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 43.

EXAMPLE 45

The forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Cu_(1/3) Nb_(2/3)) O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Cu_(1/3) Nb_(2/3))O₃ of 2.0 wt % was added instead of the forming agent Sr₀.8 Ba₀.1 Ca₀.1 Mn_(1/2) Nb_(1/2))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(1/2) Nb_(1/2))O₃ of 2.0 wt % to form a grain boundary depletion all of which also function as control agents to control the grain growth of Example 42. The manufacturing method for other materials, sintering accelerant or the like, was the same as Example 42 and electric characteristics thereof were measured by the same method as Example 42. The forming agent to form a grain boundary depletion was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, Mb₂ O₅, and CuO, sintering at 900° C. and grinding

The results are shown in Table 45.

                                      TABLE 45                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth Pr.sub.6 O.sub.11                                                               mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3800                                                                               1.9  880     13                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.4  920     12                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3600                                                                               1.8  910     13                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub. 0.1 Ca.sub.0.1                                                          1.5     3.0     3500                                                                               1.9  920     12                           0.05 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     3700                                                                               1.8  890     11                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3600                                                                               1.2  900     12                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3400                                                                               2.8  910     13                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.0     3500                                                                               1.7  920     13                           0.50 (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3800                                                                               1.9  890     13                                (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     3700                                                                               1.3  870     13                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3600                                                                               1.8  910     12                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.0     3500                                                                               1.9  920     13                           2.0  (Cu.sub.1/3 Nb.sub.2/3)O.sub.3 2.0                              __________________________________________________________________________

As is apparent from the results in Table 45, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb O₂, ₅ La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a solid electrolyte Pr₆ O₁₁ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 43.

EXAMPLE 46

A sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ (ratio of 20:30:45 wt %) of 0.05 to 5.0 wt % mainly forming a liquid phase at a high temperature, a semiconducting accelerant Nb₂ O₅ of 0.02 to 3.0 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte CeO₂ of 0.05 to 4.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(2/3) W_(1/3))O₃ (0.1 to 8.0 wt %) to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to strontium titanat (SrTiO₃) obtained by pyrolyzing titanyl strontium oxalate (SrTio(C₂ O₄)₂ ·4H₂ O) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1300° C. in the air. It was reground in a wet state, made into paste using resin and organic solutions so as to form a sheet, printed platinum paste for inner electrodes were laminated theron, sintered at 1400° C. in the air followed by the hydrogen reduction at 1300° C., and heat-treated at 950° C. in the air. Finally, electrodes were adjusted so as to connect inner electrodes with outer electrodes, thereby completing the manufacture of a laminated ceramic capacitor having grain boundary varistor characteristics of FIG. 1. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 46. The sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ (ratio of 20:35:45 wt %) was obtained by weighing commercial TiO₂, Al₂ O₃ and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Mn_(2/3) W_(1/3))O₃ to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃, MnCO₃ or the like, calcinating at 1000° C., and grinding. The size of the varistor after sintering was approximately 4 mm square and about 0.6 mm in thickness and composed of 8 layers of the dielectrics, each of which was about 70 pm in thickness. The apparent dielectric constant was calculated from the value of the capacitance (measurement 1 kHz) of the laminated varistor. The grain diameter in the sintered body was obtained by examining a cross section after polishing under an optical microscope, to the surface of which Bi₂ O₃ series metallic soap was applied and heat-treated at 1000° C. to make the grain boundary clear.

                                      TABLE 46                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    Sr(Mn.sub.2/3 W.sub.1/3)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  1.5         1.0     1.5     2400                                                                               25.0 430     6.5                0.1       0.2  1.5         1.0     3.5     4100                                                                               4.2  840     13                 0.5       0.2  1.5         1.0     4.0     4800                                                                               2.9  750     14                 1.0       0.2  1.5         1.0     3.5     4300                                                                               2.5  820     13                 3.0       0.2  1.5         1.0     3.5     4100                                                                               3.1  840     13                 5.0       0.2  1.5         1.0     4.0     4800                                                                               2.0  760     14                 1.0       0.02 1.5         1.0     4.0     3100                                                                               35.0 450     5.0                1.0       0.05 1.5         1.0     4.0     4800                                                                               4.3  720     13                 1.0       0.5  1.5         1.0     3.5     4200                                                                               2.9  820     14                 1.0       2.0  1.5         1.0     4.0     5300                                                                               3.0  750     13                 1.0       3.0  1.5         1.0     3.5     2500                                                                               22.0 480     4.0                1.0       0.2  0.1         1.0     3.5     3400                                                                               18.5 510     4.0                1.0       0.2  0.2         1.0     4.0     5200                                                                               2.2  760     12                 1.0       0.2  1.0         1.0     3.5     4300                                                                               2.1  820     13                 1.0       0.2  3.0         1.0     4.0     4900                                                                               3.0  720     13                 1.0       0.2  6.0         1.0     3.5     4200                                                                               2.1  820     13                 1.0       0.2  8.0         1.0     1.5     2800                                                                               5.5  450     6.0                1.0       0.2  1.5         0.05    2.5     2200                                                                               17.5 420     3.5                1.0       0.2  1.5         0.1     3.5     4200                                                                               2.4  830     13                 1.0       0.2  1.5         0.3     4.0     5000                                                                               2.1  710     14                 1.0       0.2  1.5         1.0     3.5     4100                                                                               2.0  880     13                 1.0       0.2  1.5         3.0     3.5     4200                                                                               3.0  810     13                 1.0       0.2  1.5         4.0     1.5     2500                                                                               15.5 380     4.0                __________________________________________________________________________

As is apparent from the results in Table 46, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt %, and a forming agent Sr(Mn_(2/3) W_(1/3))O₃ of 0.2 to 6.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a varistor with high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and approximately 3.5 to 4.0 μm and the dielectric loss was 5.0% or less and the apparent dielectric constant was 4000 or more. The riser voltage V₁ mA of the materials as a varistor was 700 to 900 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 47

A sintering accelerant of 1.0 wt % selected from TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %), TiO₂ --MnO--SiO₂ series (for example, ratio of 10:50:40 wt %), TiO₂ --Al₂ O₃ --SiO₂ series (for example, ratio of 20:35:45 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant Y₂ O₃ of 0.4 wt % which can form a solid solution with perovskite type oxides, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which functions as a control agent to control the grain growth, and a forming agent Sr(Mn_(2/3) W_(1/3))O₃ of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molded into a disk shape, sintered at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and silver electrodes were formed on both sides of the disk, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 47. The sintering accelerant TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO and SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent Sr(Mn_(2/3) W_(1/3)) O₃ to form a grain boundary depletion layer which also function as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, WO₃ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 47                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     Sr(Mn.sub.2/3 W.sub.1/3)O.sub.3                                                            growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.5     4100                                                                               3.2  830     13                 1.0       0.4  4.0         1.0     3.5     4200                                                                               3.4  850     12                 1.0       0.4  1.0         0.2     4.0     4500                                                                               2.9  750     13                 1.0       0.4  1.0         2.0     3.5     4300                                                                               3.7  810     14                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.7     4800                                                                               3.3  820     12                 1.0       0.4  4.0         1.0     3.7     4500                                                                               3.2  810     11                 1.0       0.4  1.0         0.2     3.4     5000                                                                               3.2  850     11                 1.0       0.4  1.0         2.0     4.0     4800                                                                               3.0  740     14                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     5100                                                                               3.9  770     13                 1.0       0.4  4.0         1.0     3.7     4600                                                                               2.9  800     11                 1.0       0.4  1.0         0.2     3.7     4500                                                                               3.9  780     13                 1.0       0.4  1.0         2.0     3.5     4100                                                                               3.2  860     12                 __________________________________________________________________________

As is apparent from the results in Table 47, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt %, a semiconducting accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 46.

EXAMPLE 48

A sintering accelerant of 30 wt % of TiO₂ --MgO--SiO₂ series (for example, ratio of 30:30:40 wt %) mainly forming a liquid phase at a high temperature, semiconducting accelerants WO₃ ·Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 2.0 wt %, a good oxygen conductive solid electrolyte CeO₂ of 1.5 wt % which functions as a control agent to control the grain growth, and a forming agent Sr₀.8 Ba₀.1 Ca₀.1 (Mn_(2/3) W_(1/3))O₃ or Sr₀.6 Ba₀.2 Ca₀.2 (Mn_(2/3) W_(1/3))O₃ of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to commercial industrial strontium titanat (SrTiO₃) and mixed well followed by calcination at 900° C. Then it was ground in a wet state followed by drying, making grain, and molding, sintering at 1380° C. in the reducing atmosphere composed of 95% of nitrogen and 5% of hydrogen. It was heat-treated at 950° C. in the air and electrodes were formed, thereby completing the manufacture of a ceramic capacitor having grain boundary varistor characteristics of FIG. 2. Electric characteristics of the laminated ceramic capacitor were measured and the results are shown in Table 48. The sintering accelerant TiO₂ --MgO--SiO₂ series (ratio of 30:30:40 wt %) was obtained by weighing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding. The forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, BaCO₃, CaCO₃, WO₃ and MnCO₃, calcinating at 900° C., and grinding.

                                      TABLE 48                                     __________________________________________________________________________                                solid electrolyte                                                  forming agent to form a                                                                    which functions                                               semicon-                                                                            grain boundary deple-                                                                      as a control                                                  ducting                                                                             tion layer which also                                                                      agent to control                                    sintering accelerant                                                                     accel-                                                                              functions as a control                                                                     the grain                                           TiO.sub.2 --MgO--SiO.sub.2                                                               erant                                                                               agent to control the                                                                       growth CeO.sub.2                                                                       mean grain                                  compound (wt %)                                                                          (wt %)                                                                              grain growth (wt %)                                                                        (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     3.0       WO.sub.3 0.05                                                                       Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.7     4500                                                                               3.8  780     14                                (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4700                                                                               3.2  740     14                           0.05 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     5100                                                                               3.3  810     13                           0.05 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub. 0.1                                                          1.5     3.7     4400                                                                               3.6  810     12                           0.05 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       WO.sub.3 0.50                                                                       Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     4900                                                                               3.1  770     13                                (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.7     4500                                                                               3.3  790     12                           0.50 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     3.5     4300                                                                               3.7  850     14                           0.50 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.6 Ba.sub.0.2 Ca.sub.0.2                                                           1.5     4.0     5100                                                                               3.0  760     13                           0.50 (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       WO.sub.3 2.0                                                                        Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.7     4500                                                                               3.9  780     14                                (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Nb.sub.2 O.sub.5                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.5     4200                                                                               3.5  860     13                           2.0  (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       La.sub.2 O.sub.3                                                                    Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     4.0     4700                                                                               3.7  740     14                           2.0  (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               3.0       Y.sub.2 O.sub.3                                                                     Sr.sub.0.8 Ba.sub.0.1 Ca.sub.0.1                                                           1.5     3.7     4400                                                                               3.2  810     13                           2.0  (Mn.sub.2/3 W.sub.1/3)O.sub.3 2.0                               __________________________________________________________________________

As is apparent from the results in Table 48, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ series of 3.0 wt %, semiconducting accelerants WO₃, Nb₂ O₅, La₂ O₃ and Y₂ O₃ of 0.05 to 0.5 or 1.0 wt %, a solid electrolyte CeO₂ of 1.5 wt % which also functions as a control agent to control the grain growth, and a forming agent of 2.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a varistor with high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 46.

EXAMPLE 49

A capacitor was manufactured according to the method in Example 46 including the manufacturing method for other materials, sintering accelerant or the like, except that a compound SrO·1/3Mn₂ O₃ 1/3MoO₃ (0.1 to 6.0 wt %) was used as a forming agent instead of the forming agent Sr(Mn_(2/3) W_(1/3))O₃ (0.1 to 6.0 wt %) to form a grain boundary depletion and electric characteristics thereof were measured by the same method as Example 46. The results are shown in Table 49. The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ to form a grain boundary depletion which also functions as a control agent to control the grain growth was obtained by mixing commercial SrCO₃, MoO₃, MnCO₃ or the like, sintering at 1000° C. and grinding.

                                      TABLE 49                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                    sintering accelerant                                                                     erant                                                                               grain growth                                                                               the grain                                           TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                                 Nb.sub.2 O.sub.5                                                                    SrO.1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3                                                       growth CeO.sub.2                                                                       mean grain       rising voltage             compound (wt %)                                                                          (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     0.05      0.2  1.5         1.0     2.0     3500                                                                               16.5 270     4.5                0.1       0.2  1.5         1.0     3.5     4200                                                                               3.4  810     11                 0.5       0.2  1.5         1.0     4.0     4800                                                                               3.5  760     12                 1.0       0.2  1.5         1.0     3.5     3900                                                                               3.6  830     13                 3.0       0.2  1.5         1.0     4.0     5200                                                                               3.8  780     12                 5.0       0.2  1.5         1.0     3.5     4300                                                                               3.1  830     12                 1.0       0.02 1.5         1.0     2.5     2500                                                                               26.5 270     3.5                1.0       0.05 1.5         1.0     3.5     4300                                                                               3.9  890     11                 1.0       0.5  1.5         1.0     3.5     4100                                                                               3.2  870     12                 1.0       2.0  1.5         1.0     4.0     4700                                                                               3.1  760     11                 1.0       3.0  1.5         1.0     2.5     3800                                                                               22.5 270     4.5                1.0       0.2  0.1         1.0     3.0     4200                                                                               38.0 260     2.5                1.0       0.2  0.2         1.0     4.0     4800                                                                               3.2  720     11                 1.0       0.2  0.5         1.0     3.5     3900                                                                               3.5  850     12                 1.0       0.2  1.0         1.0     3.5     4300                                                                               3.1  870     13                 1.0       0.2  5.0         1.0     3.5     4100                                                                               3.1  870     13                 1.0       0.2  6.0         1.0     2.0     3700                                                                               18.2 350     8.5                1.0       0.2  1.5         0.05    3.0     4300                                                                               21.3 310     7.0                1.0       0.2  1.5         0.1     4.0     4900                                                                               3.1  780     12                 1.0       0.2  1.5         0.5     3.5     3900                                                                               3.4  860     12                 1.0       0.2  1.5         1.0     3.5     4200                                                                               3.8  840     13                 1.0       0.2  1.5         3.0     4.0     4600                                                                               3.4  790     12                 1.0       0.2  1.5         4.0     2.0     3200                                                                               22.9 420     3.5                __________________________________________________________________________

As is apparent from the results in Table 49, the present material obtained by adding SrTiO₃ to a sintering accelerant TiO₂ --Al₂ O₃ --SiO₂ of 0.1 to 5.0 wt %, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt %, a solid electrolyte CeO₂ 0.1 to 3.0 wt %, and a forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ of 0.2 to 5.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics with uniform grain diameter and can be used as a ceramic capacitor with varistor characteristics having high capacitance. According to a microscopic examination, the grain diameters of corpuscles in the sintered body were uniform and the mean grain diameter was approximately 3.5 to 4.0 μm and the dielectric loss was 4.0% or less and the apparent voltage V₁ mA of the materials as a varistor was 700 to 900 V/mm and the resistance non-linearity coeffecient α is 10 or more in most cases between V₁ mA to V₀.1 mA. Other values such as surge durability as a varistor, the ratio of limited voltage representing the resistance non-linearity coeffecient in high current area, the temperature coefficient of the riser voltage V₁ mA and capacitance were measured and sufficient values were obtained. When the amount of the sintering accelerant added exceeds 5%, the sintered body is prone to deform or adhere, therefore it is not practical.

EXAMPLE 50

A capacitor was manufactured according to the method in Example 47 including the manufacturing method for other materials, sintering accelerant or the like, except that the forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.4 to 4.0 wt %) was used instead of the forming agent Sr(Mn_(2/3) W_(1/3)) (0.4 to 4.0 wt %) to form a grain boundary depletion and electric characteristics thereof were measured by the same method as Example 47. The results are shown in Table 50. The forming agent SrO·1/3Mn₂ O₃ ·1/3MoO₃ to form a grain boundary depletion which also functions as a control agent to control grain growth was obtained by mixing commercial SrCO₃, MoO₃, MnCO₃ or the like, sintering at 1000° C. and grinding. The sintering accelerant, for example, TiO₂ --MgO--SiO₂ series (ratio of 30:30:40 wt %) was obtained by weighing and mixing commercial TiO₂, MgO, SiO₂ powder according to the predetermined weight ratio, mixing, calcinating at 1200° C., and grinding.

                                      TABLE 50                                     __________________________________________________________________________                    forming agent to form a                                                        grain boundary deple-                                                                      solid electrolyte                                             semicon-                                                                            tion layer which also                                                                      which functions                                               ducting                                                                             functions as a control                                                                     as a control                                                  accel-                                                                              agent to control the                                                                       agent to control                                              erant                                                                               grain growth                                                                               the grain                                           sintering accelerant                                                                     Y.sub.2 O.sub.3                                                                     SrO.1/3Mn.sub.2 O.sub.3.1/3MoO.sub.3                                                       growth CeO.sub.2                                                                       mean grain                                  (wt %)    (wt %)                                                                              (wt %)      (wt %)  diameter (μm)                                                                       ε                                                                          tan δ (%)                                                                     V.sub.1 mA                                                                             α            __________________________________________________________________________     TiO.sub.2 --Al.sub.2 O.sub.3 --SiO.sub.2                                       compound                                                                       1.0       0.4  0.4         1.0     3.7     4900                                                                               3.4  790     11                 1.0       0.4  4.0         1.0     3.7     4700                                                                               3.5  830     11                 1.0       0.4  1.0         0.2     4.0     5100                                                                               3.6  750     12                 1.0       0.4  1.0         2.0     3.7     4400                                                                               3.3  770     11                 TiO.sub.2 --MnO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     3.5     4200                                                                               3.7  830     11                 1.0       0.4  4.0         1.0     3.5     4000                                                                               3.4  840     12                 1.0       0.4  1.0         0.2     3.7     4200                                                                               3.4  810     11                 1.0       0.4  1.0         2.0     3.5     3900                                                                               3.6  830     12                 TiO.sub.2 --MgO--SiO.sub.2                                                     compound                                                                       1.0       0.4  0.4         1.0     4.0     5100                                                                               3.3  760     12                 1.0       0.4  4.0         1.0     3.5     4100                                                                               3.6  850     12                 1.0       0.4  1.0         0.2     4.0     5300                                                                               3.7  750     11                 1.0       0.4  1.0         2.0     3.7     4600                                                                               3.7  770     12                 __________________________________________________________________________

As is apparent from the results in Table 50, the present material obtained by adding SrTiO₃ to a sintering accelerant such as TiO₂ --MgO--SiO₂ of 1.0 wt % mainly forming a liquid phase at a high temperature, a sintering accelerant Y₂ O₃ of 0.4 wt %, a good oxygen conductive solid electrolyte CeO₂ of 0.2 to 2.0 wt % which also functions as a control agent to control the grain growth, and a forming agent of 0.4 to 4.0 wt % to form a grain boundary depletion layer which also functions as a control agent to control the grain growth and sintering has excellent varistor and dielectric characteristics and can be used as a ceramic capacitor with varistor characteristics having high capacitance. The electric characteristics of the materials used in these devices are similar to those used in Example 49.

In examples 2, 3, 5, 6, 8, 9, 11, 12, 14, 15, 17, 18, 20, 21, 23 and 24, when a sintering accelerant a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, calcinated to reduce at 800° to 1500° C. and then heat-treated at 900° to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed.

In examples 1, 4, 7, 10, 13, 16, 19 and 22, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, were added to and mixed with SrTiO₃, molded under pressure, sintered at 1200° C. to 1500° C. in the air, re-ground so as to laminate with metal inner electrodes alternately, and sintered at 1250° C. to 1500° C. in the air followed by the reduction at 800° C. to 1500° C. in the reducing atmosphere containing hydrogen, and heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples 26, 27, 29, 30, 32, 33, 35, 36, 38 and 39, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte, which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, were added to and mixed with SrTiO₃, molded under pressure, calcinated to reduce at 1100° C. to 1500° C. and then heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples 25, 28, 31, 34 and 37, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, sintered at 1200° C. to 1500° C. in the air, re-ground so as to laminate with noble metal inner electrodes alternately, and sintered at 1250° C. to 1500° C. in the air followed by the reduction at 900° C. to 1150° C. in the reducing atmosphere containing hydrogen, and heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples 41, 42, 44 and 45, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, calcinated to reduce at 1100° C. to 1500° C. and then heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples and 43, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, sintered at 1200° C. to 1500° C. in the air, re-ground so as to laminate with noble metal inner electrodes alternately, and sintered at 1250° C. to 1500° C. in the air followed by the reduction at 900° C. to 1150° C. in the reducing atmosphere containing hydrogen, and heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples 47, 48 and 50, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer, which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, calcinated to reduce at 900° C. to 1500° C. and then heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed. In examples 46 and 49, when a sintering accelerant, a semiconducting accelerant, a good oxygen conductive solid electrolyte which functions as a control agent to control the grain growth, and a forming agent to form a grain boundary depletion layer, which also functions as a control agent to control the grain growth were added to and mixed with SrTiO₃, molded under pressure, sintered at 1100° C. to 1500° C. in the air, re-ground so as to laminate with noble metal inner electrodes alternately, and sintered at 1250° C. to 1500° C. in the air followed by the reduction at 900° C. to 1500° C. in the reducing atmosphere containing hydrogen, and heat-treated at 900° C. to 1150° C. in the oxidizing atmosphere, the same results obtained from each example were confirmed.

INDUSTRIAL APPLICABILITY

As described above, according to the present invention, a ceramic capacitor having varistor characteristics is manufactured by the steps comprising; adding a sintering accelerant of 0.1 to 5.0 wt % mainly composed of the mixture and forming a liquid phase at a high temperature, a semiconducting accelerant Nb₂ O₅ of 0.05 to 2.0 wt % that can form a solid solution with perovskite type oxides, and a control agent for porous sintering and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering and reducing at 1250° C. to 1500° C., heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere so as to form electrodes. Therefore, a uniform porous body can be obtained without complicated processes of coating and diffusing Bi₂ O₃ or the like, and, moreover, the size of the porous body is not subject to any particular restriction. The effects of the present application are greatly improved from the point of view of practical applications. 

I claim:
 1. A method for manufacturing a ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %), a semiconducting accelerant (0.05 to 2.0 wt %) that can form a solid solution with perovskite type oxides, a control agent to control the grain growth ZrO₂ (0.1 to 10.0 wt %) and a forming agent to form a grain boundary depletion layer Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering and reducing at 800° C. to 1500° C., and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere so as to form electrodes.
 2. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 1, wherein, in at least one of said sintering accelerant, a semiconducting accelerant, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, said sintering accelerant is selected from at least the series consisting of TiO₂ --MgO--SiO₂, TiO₂ --MnO-- SiO₂ or TiO₂ --Al₂ O₃ --SiO₂ ; said semiconducting accelerant is an oxide (0.05 to 2.0 wt %) selected from at least WO₃, Nb₂ O₅, La₂ O₃, and Y₂ O₂ ; and said forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth is selected from Sr(Cu_(1/3) Ta_(2/3))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) Nb_(2/3))O₃ (0.2 to 6.0 wt %), Sr(Co_(1/3) Ta_(2/3))O₃ (0.2 to 8.0 wt %), Sr(Cu_(1/2) W_(1/2))O₃ (0.2 to 6.0 wt %), Sr(Co_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) Mo_(1/2))O₃ (0.2 to 6.0 wt %), SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.2 to 4.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Cu_(1/3Nb) _(2/3))O₃ (0<x+y≦1) (0.2 to 4.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(x) (Cu_(1/3Ta) _(2/3))O₃ (0<x+y≦1), (0.2 to 5.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(x) (Co_(1/3) Nb_(2/3))O₃ (0<x+y≦1) (0.2 to 6.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(x) (Co_(1/3) Ta_(2/3))O₃ (0<x+y≦1), (0.2 to 7.0 wt %) Sr_(1-x-y) Ba_(x) Ca_(x) (Cu_(1/2) W_(1/2))O₃ (0<x+y≦1) (0.2 to 6.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(x) (Co_(1/2) W_(1/2))O₃ (0<x+y≦1), (0.2 to 5.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(x) (Co_(1/3) Mo_(2/3))O₃ (0<x+y≦1), (0.2 to 5.0 wt %), or (1-X-Y)SrO·XBaO·YCaO·1/3Mn₂ O₃ ·1/3MoO₃ (0<x+y≦1), (0.2 to 5.0 wt %).
 3. A method for manufacturing a laminated ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %), a semiconducting accelerant (0.05 to 2.0 wt %), a solid electrolyte ZrO₂ (0.1 to 10.0 wt %) which functions as a control agent to control the grain diameter, and a forming agent to form a grain boundary depletion layer Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering at 1200° to 1500° C. in the air, re-grinding so as to laminate with noble metal inner electrodes alternately, and sintering at 1250° C. to 1500° C. in the air followed by the reduction at 800° C. to 1500° C. in the reducing atmosphere containing hydrogen, and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere.
 4. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 3, wherein one of Sr(Cu_(1/3) Ta_(2/3))O₃ (0.2 to 5.0 wt %), (Co_(1/3) Nb_(2/3))O₃ (0.2 to 6.0 wt %), Sr(Co_(1/3) Ta_(2/3))O₃ (0.2 to 7.0 wt %), Sr(Cu_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) Mo_(1/2))O₃ (0.2 to 5.0 wt %) or SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.2 to 8.0 wt %) is added as at least a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth.
 5. A method for manufacturing a ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant (0.05 to 2.0 wt %) that can form a solid solution with perovskite type oxides, a control agent to control the grain growth CeO₂ (0.1 to 3.0 wt %) and a forming agent to form a grain boundary depletion layer Sr(Mn_(1/2) Nb_(1/2))O₃ (0.2 to 10.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering and reducing at 1100° C. to 1500° C., and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere so as to form electrodes.
 6. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 5, wherein, in at least one of said sintering accelerant, a semiconducting accelerant, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, said sintering accelerant is selected from at least the series consisting of TiO₂ --MgO--SiO₂, TiO₂ --MnO--SiO₂ or TiO₂ --Al₂ O₃ --SiO₂ ; said semiconducting accelerant is an oxide (0.05 to 2.0 wt %) selected from at least WO₃, Nb₂ O₅, La₂ O₃, and Y₂ O₃ ; and said forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth is selected from Sr(Mn_(1/2) Ta_(1/2))O₃ (0.2 to 10.0 wt %), Sr(Cu_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Mn_(1/2) Nb_(1/2))O₃ (0<x+y≦1), (0.2 to 10.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Mn_(1/2) Ta_(1/2))O₃ (0<x+y≦1), (0.2 to 10.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Cu_(1/2) W_(1/2))O₃ (0<x+y≦1) (0.2 to 5.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Co_(1/2) W_(1/2))O₃ (0<x+y≦1), (0.2 to 5.0 wt %), or Sr_(1-x-y) Ba_(x) Ca_(y) (Cu_(1/3) Nb_(2/3))O₃ (0<x+y≦1), (0.2 to 4.0 wt %).
 7. A method for manufacturing a laminated ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %), a semiconducting accelerant (0.05 to 2.0 wt %), a solid electrolyte CeO₂ (0.1 to 3.0 wt %) and a forming agent to form a grain boundary depletion layer Sr(Mn_(1/3) Nb_(2/3) O₃ (0.2 to 10.0 wt %) which functions as a control agent to control the grain diameter, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering at 1200° to 1500° C. in the air, re-grinding so as to laminate with noble metal inner electrodes alternately, sintering at 1250° C. to 1500° C. in the air followed by the reduction at 900° C. to 1400° C. in the reducing atmosphere containing hydrogen, and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere.
 8. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 7, wherein one of Sr(M_(1/2) Ta_(1/2))O₃ (0.2 to 10.0 wt %), Sr(Cu_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), Sr(Co_(1/2) W_(1/2))O₃ (0.2 to 5.0 wt %), or Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %) is added, instead of Sr(Mn_(1/2) Nb_(1/2))O₃ (0.2 to 10.0 wt %) as at least a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth.
 9. A method for manufacturing a ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant (0.05 to 2.0 wt %) that can form a solid solution with perovskite type oxides, a control agent to control the grain growth Pr₆ O₁₁ (0.1 to 4.0 wt %) and a forming agent to form a grain boundary depletion layer Sr(Mn_(1/2) Nb_(1/2))O₃ (0.2 to 10.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate pressure, sintering and reducing at 1150° C. to 1500° C., heat-treating at 900° C. to 1250° C. in the oxidizing atmosphere so as to form electrodes.
 10. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 9, wherein, in at least one of said sintering accelerant, a semiconducting accelerant, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, said sintering accelerant is selected from at least the series consisting of TiO₂ --MgO--SiO₂, TiO₂ --MnO--SiO₂ or TiO₂ --Al₂ O₃ --SiO₂ ; said semiconducting accelerant is an oxide (0.05 to 2.0 wt %) selected from at least WO₃, Nb₂ O₅, La₂ O₃, and Y₂ O₃ ; and said form a grain boundary depletion layer which also functions as a control agent to control the grain growth is selected from Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %), Sr_(1-x-y) Ba_(x) Ca_(y) (Mn_(1/2) Nb_(1/2))O₃ (0<x+y≦1), (0.2 to 10.0 wt %), or Sr_(1-x-y) Ba_(x) Ca_(y) (Cu_(1/3) Nb_(2/3))O₃ (0<x+y≦1), (0.2 to 4.0 wt %).
 11. A method for manufacturing a laminated ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %), a semiconducting accelerant (0.05 to 2.0 wt %) that can form a solid solution with perovskite type oxides, a solid electrolyte Pr₆ O₁₁ (0.1 to 4.0 wt %) which also functions as a control agent to control the grain diameter and a forming agent to form a grain boundary depletion layer Sr(Mn_(1/3) Nb_(2/3))O₃ (0.2 to 10.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering at 1200° C. to 1500° C. in the air, re-grinding so as to laminate with noble metal inner electrodes alternately, and sintering at 1250° C. to 1500° C. in the air, followed by the reduction at 900° C. to 1400° C. in the reducing atmosphere containing hydrogen, and heat-treating at 900° C. to 1250° C. in the oxidizing atmosphere.
 12. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 11, wherein Sr(Cu_(1/3) Nb_(2/3))O₃ (0.2 to 4.0 wt %), is added, instead of Sr(Mn_(1/2) Nb_(1/2))O₃ (0.2 to 10.0 wt %) as at least a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth.
 13. A method for manufacturing a ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %) mainly forming a liquid phase at a high temperature, a semiconducting accelerant that can form a solid solution with perovskite type oxides, and a good oxygen conductive solid electrolyte CeO₂ (0.1 to 3.0 wt %) which functions as a control agent to control the grain growth and a forming agent to form a grain boundary depletion layer Sr(Mn_(2/3W) _(1/3))O₃ (0.2 to 6.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under pressure, sintering and reducing at 900° C. to 1500° C., and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere so as to form electrodes.
 14. A method for manufacturing a laminated ceramic capacitor having varistor characteristics comprising the steps of; adding a sintering accelerant (0.1 to 5.0 wt %), a semiconducting accelerant (0.05 to 2.0 wt %), a solid electrolyte CeO₂ (0.1 to 3.0 wt %) which also functions as a control agent to control the grain diameter and a forming agent to form a grain boundary depletion layer Sr(Mn_(2/3) W_(1/3))O₃ (0.2 to 6.0 wt %) which also functions as a control agent to control the grain growth, to perovskite type oxides powder made of the materials of strontium titanate (SrTiO₃) as a main component, mixing and molding under the pressure, sintering at 1100° C. to 1500° C. in the air, re-grinding so as to laminate with noble metal inner electrodes alternately, sintering at 1250° C. to 1500° C. in the air, followed by the reduction at 900° C. to 1500° C. in the reducing atmosphere containing hydrogen, and heat-treating at 900° C. to 1150° C. in the oxidizing atmosphere.
 15. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 13 wherein, in at least one of said sintering accelerant, a semiconducting accelerant, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, said sintering accelerant is selected from at least the series consisting of TiO₂ --MgO--SiO₂, TiO₂ --MnO--SiO₂ or TiO₂ --Al₂ O₃ --SiO₂ ; said semiconducting accelerant is an oxide selected from at least WO₃, Nb₂ O₅, La₂ O₃, and Y₂ O₃ ; and said forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth is selected from one of SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.2 to 5.0 wt %) and Sr_(1-x-y) Ba_(x) Ca_(y) (Mn_(2/3) W_(1/3))O₃ (0<x+y≦1) (0.2 to 6.0 wt %).
 16. A method for manufacturing a ceramic capacitor having varistor characteristics according to claim 14, wherein, in at least one of said sintering accelerant, a semiconducting accelerant, and a forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth, said sintering accelerant is selected from at least the series consisting of TiO₂ --MgO--SiO₂, TiO₂ --MnO-- SiO₂ or TiO₂ --Al₂ O₃ --SiO₂ ; said semiconducting accelerant is an oxide selected from at least WO₃, Nb₂ O₅, La₂ O₃, and Y₂ O₃ ; and said forming agent to form a grain boundary depletion layer which also functions as a control agent to control the grain growth is selected from one of SrO·1/3Mn₂ O₃ ·1/3MoO₃ (0.2 to 5.0 wt %) and Sr_(1-x-y) Ba_(x) Ca_(y) (Mn_(2/3) W_(1/3))O₃ (0<x+y≦1) (0.2 to 6.0 wt %). 